TY - GEN
T1 - Optimization of O2 Plasma Treatment on Cu Surface for Hybrid Cu Bonding
AU - Park, Sangwoo
AU - Lee, Sangmin
AU - Choi, Junyoung
AU - Kim, Sarah Eunkyung
N1 - Publisher Copyright:
© 2024 Japan Institute of Electronics Packaging.
PY - 2024
Y1 - 2024
N2 - Pre-surface treatment in hybrid Cu bonding is plays a crucial role in improving bonding quality. Among the various pre-surface treatment methods, O2 plasma treatment is known to significantly enhance a mechanical bonding property of dielectric-to-dielectric bonding. In this study, we focused on optimizing the condition of O2 plasma treatment for enhancing the quality of Cu bonding and studing the bonding mechanism. The condition for O2 plasma treatment were optimized using the Response Surface Methodology (RSM) based on Design of Experiments (DOE), utilizing the results obtained from X-ray Photoelectron Spectroscopy (XPS). Subsequently, bonding was conducted at 260°C and 1.4 MPa for 1 hour. Following this, annealing was performed at 200°C for an additional hour. The bonding mechanism was analyzed through Transmission Electron Microscopy (TEM) analysis. Through this study, it is possible to understand the effect of O2 plasma on the Cu surface and its role in hybrid Cu bonding.
AB - Pre-surface treatment in hybrid Cu bonding is plays a crucial role in improving bonding quality. Among the various pre-surface treatment methods, O2 plasma treatment is known to significantly enhance a mechanical bonding property of dielectric-to-dielectric bonding. In this study, we focused on optimizing the condition of O2 plasma treatment for enhancing the quality of Cu bonding and studing the bonding mechanism. The condition for O2 plasma treatment were optimized using the Response Surface Methodology (RSM) based on Design of Experiments (DOE), utilizing the results obtained from X-ray Photoelectron Spectroscopy (XPS). Subsequently, bonding was conducted at 260°C and 1.4 MPa for 1 hour. Following this, annealing was performed at 200°C for an additional hour. The bonding mechanism was analyzed through Transmission Electron Microscopy (TEM) analysis. Through this study, it is possible to understand the effect of O2 plasma on the Cu surface and its role in hybrid Cu bonding.
KW - 3D packaging
KW - Hybrid Cu bonding
KW - O plasma treatment
KW - Surface pretreatment
UR - http://www.scopus.com/inward/record.url?scp=85195468933&partnerID=8YFLogxK
U2 - 10.23919/ICEP61562.2024.10535589
DO - 10.23919/ICEP61562.2024.10535589
M3 - Conference contribution
AN - SCOPUS:85195468933
T3 - 2024 International Conference on Electronics Packaging, ICEP 2024
SP - 303
EP - 304
BT - 2024 International Conference on Electronics Packaging, ICEP 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd International Conference on Electronics Packaging, ICEP 2024
Y2 - 17 April 2024 through 20 April 2024
ER -