TY - GEN
T1 - Pattern density effect on interfacial bonding characteristics of Cu-Cu direct bonds for 3D IC packages
AU - Park, J. M.
AU - Kim, J. B.
AU - Kim, J. W.
AU - Kim, Y. R.
AU - Kim, S. E.
AU - Park, Y. B.
PY - 2012
Y1 - 2012
N2 - In this study, effect interfacial bonding strength on pattern density was evaluated. The Silicon oxide(SiO2) on parallel patterned Cu lines wafer can be removed by using a solution of buffered oxide etch and sulfuric acid (BOE/H2SO4) to improve the bonding quality of Cu-Cu pattern direct bonds. Two 8-inch Cu wafers were bonded at 400°C via the thermocompression method. The interfacial adhesion energy of Cu-Cu pattern direct bonding was quantitatively measured by the four-point bending method. After BOE for 2 min/H2SO4 for 1 min wet pretreatment, the interfacial adhesion energies with pattern density of 0.06, and 0.23 were 7.9, and 4.1 J/m2, respectively. Therefore, the CMP planarization is critical to have reliable bonding quality of Cu pattern direct bonds.
AB - In this study, effect interfacial bonding strength on pattern density was evaluated. The Silicon oxide(SiO2) on parallel patterned Cu lines wafer can be removed by using a solution of buffered oxide etch and sulfuric acid (BOE/H2SO4) to improve the bonding quality of Cu-Cu pattern direct bonds. Two 8-inch Cu wafers were bonded at 400°C via the thermocompression method. The interfacial adhesion energy of Cu-Cu pattern direct bonding was quantitatively measured by the four-point bending method. After BOE for 2 min/H2SO4 for 1 min wet pretreatment, the interfacial adhesion energies with pattern density of 0.06, and 0.23 were 7.9, and 4.1 J/m2, respectively. Therefore, the CMP planarization is critical to have reliable bonding quality of Cu pattern direct bonds.
UR - https://www.scopus.com/pages/publications/84879748153
U2 - 10.1109/EPTC.2012.6507075
DO - 10.1109/EPTC.2012.6507075
M3 - Conference contribution
AN - SCOPUS:84879748153
SN - 9781467345514
T3 - Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
SP - 185
EP - 188
BT - Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
T2 - 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012
Y2 - 5 December 2012 through 7 December 2012
ER -