Pd-doped Sn-Ag-Cu-In solder material for high drop/shock reliability

A. Mi Yu; Jun Ki Kim; Jong Hyun Lee; Mok Soon Kim

doi:10.1016/j.materresbull.2009.12.030

Pd-doped Sn-Ag-Cu-In solder material for high drop/shock reliability

A. Mi Yu, Jun Ki Kim, Jong Hyun Lee, Mok Soon Kim

Dept. of Materials Science & Engineering

Research output: Contribution to journal › Article › peer-review

14 Scopus citations

Abstract

Pd was chosen as a minor alloying element in a new Sn-1.2Ag-0.7Cu-0.4In solder alloy to improve the drop/shock reliability. The tensile properties and drop/shock reliability of the new Sn-1.2Ag-0.7Cu-0.4In-0.03Pd solder alloy was compared with those of the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu alloys. The UTS, yield strength and elongation of Sn-1.2Ag-0.7Cu-0.4In-0.03Pd were superior to those of the other alloys tested. Sn-1.2Ag-0.7Cu-0.4In-0.03Pd showed outstanding drop/shock reliability compared to the representative Pb-free solder, Sn-3.0Ag-0.5Cu. Therefore, the Sn-1.2Ag-0.7Cu-0.4In-0.03Pd composition is assessed to be an alternative Pb-free solder composition that may replace Sn-3.0Ag-0.5Cu.

Original language	English
Pages (from-to)	359-361
Number of pages	3
Journal	Materials Research Bulletin
Volume	45
Issue number	3
DOIs	https://doi.org/10.1016/j.materresbull.2009.12.030
State	Published - Mar 2010

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title = "Pd-doped Sn-Ag-Cu-In solder material for high drop/shock reliability",

abstract = "Pd was chosen as a minor alloying element in a new Sn-1.2Ag-0.7Cu-0.4In solder alloy to improve the drop/shock reliability. The tensile properties and drop/shock reliability of the new Sn-1.2Ag-0.7Cu-0.4In-0.03Pd solder alloy was compared with those of the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu alloys. The UTS, yield strength and elongation of Sn-1.2Ag-0.7Cu-0.4In-0.03Pd were superior to those of the other alloys tested. Sn-1.2Ag-0.7Cu-0.4In-0.03Pd showed outstanding drop/shock reliability compared to the representative Pb-free solder, Sn-3.0Ag-0.5Cu. Therefore, the Sn-1.2Ag-0.7Cu-0.4In-0.03Pd composition is assessed to be an alternative Pb-free solder composition that may replace Sn-3.0Ag-0.5Cu.",

author = "Yu, \{A. Mi\} and Kim, \{Jun Ki\} and Lee, \{Jong Hyun\} and Kim, \{Mok Soon\}",

year = "2010",

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doi = "10.1016/j.materresbull.2009.12.030",

language = "English",

volume = "45",

pages = "359--361",

journal = "Materials Research Bulletin",

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T1 - Pd-doped Sn-Ag-Cu-In solder material for high drop/shock reliability

AU - Yu, A. Mi

AU - Kim, Jun Ki

AU - Lee, Jong Hyun

AU - Kim, Mok Soon

PY - 2010/3

Y1 - 2010/3

N2 - Pd was chosen as a minor alloying element in a new Sn-1.2Ag-0.7Cu-0.4In solder alloy to improve the drop/shock reliability. The tensile properties and drop/shock reliability of the new Sn-1.2Ag-0.7Cu-0.4In-0.03Pd solder alloy was compared with those of the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu alloys. The UTS, yield strength and elongation of Sn-1.2Ag-0.7Cu-0.4In-0.03Pd were superior to those of the other alloys tested. Sn-1.2Ag-0.7Cu-0.4In-0.03Pd showed outstanding drop/shock reliability compared to the representative Pb-free solder, Sn-3.0Ag-0.5Cu. Therefore, the Sn-1.2Ag-0.7Cu-0.4In-0.03Pd composition is assessed to be an alternative Pb-free solder composition that may replace Sn-3.0Ag-0.5Cu.

AB - Pd was chosen as a minor alloying element in a new Sn-1.2Ag-0.7Cu-0.4In solder alloy to improve the drop/shock reliability. The tensile properties and drop/shock reliability of the new Sn-1.2Ag-0.7Cu-0.4In-0.03Pd solder alloy was compared with those of the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu alloys. The UTS, yield strength and elongation of Sn-1.2Ag-0.7Cu-0.4In-0.03Pd were superior to those of the other alloys tested. Sn-1.2Ag-0.7Cu-0.4In-0.03Pd showed outstanding drop/shock reliability compared to the representative Pb-free solder, Sn-3.0Ag-0.5Cu. Therefore, the Sn-1.2Ag-0.7Cu-0.4In-0.03Pd composition is assessed to be an alternative Pb-free solder composition that may replace Sn-3.0Ag-0.5Cu.

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DO - 10.1016/j.materresbull.2009.12.030

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SN - 0025-5408

VL - 45

SP - 359

EP - 361

JO - Materials Research Bulletin

JF - Materials Research Bulletin

IS - 3

ER -

Pd-doped Sn-Ag-Cu-In solder material for high drop/shock reliability

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