@inproceedings{fbdb9c6d33c8459d9719acdec4dc1144,
title = "Pot life improvement of low temperature and high-speed curable anisotropic conductive adhesive (ACA)",
abstract = "In this study, the imidazole-based curing accelerator powders were coated with a chosen agent to increase the pot life of ACA resin formulation. To accomplish this simple procedure, the coating processes were tried with a vapor or molten state of the coating agent. The coating processes with the vapor state could not be cosidered as an effective conformal coating method. However, a coating process using the molten state was effective at increasing the pot life, and showed minor effect with regard to the curing and processability of final formulation.",
keywords = "ACA (anisotropic conductive adhesive), Chip bonding, High-speed curing, Pot life, RFID assembly",
author = "Lee, \{Jong Hyun\} and Kim, \{Ju Hyung\} and Hyun, \{Chang Yong\}",
year = "2009",
language = "English",
isbn = "9781424447220",
series = "2009 European Microelectronics and Packaging Conference, EMPC 2009",
booktitle = "2009 European Microelectronics and Packaging Conference, EMPC 2009",
note = "2009 European Microelectronics and Packaging Conference, EMPC 2009 ; Conference date: 15-06-2009 Through 18-06-2009",
}