TY - JOUR
T1 - Power cycling test of transfer molded IGBT modules by advanced power cycler under different junction temperature swings
AU - Choi, U. M.
AU - Jørgensen, S.
AU - Iannuzzo, F.
AU - Blaabjerg, F.
N1 - Publisher Copyright:
© 2018 Elsevier Ltd
PY - 2018/9
Y1 - 2018/9
N2 - In this paper, an effect of junction temperature swings (ΔTj) on reliability of IGBT modules is studied with 600 V, 30 A, transfer molded power modules. This study is based on power cycling test results of 18 IGBT modules under three different junction temperature swings, namely 40 °C, 60 °C and 70 °C, by means of an advanced power cycler. The advanced power cycler allows performing power cycling tests under similar conditions of IGBT modules in power electronics applications. This paper presents post-failure analysis of the tested IGBT modules of interest in order to investigate the failure mechanism and also to compare results under different Tj. Further, a lifetime factor in respect to ΔTj is modeled with different lifetime definitions and confidence levels. This paper enables a better understanding of the junction temperature swing-related failure mechanisms and reliability performance of transfer molded IGBT modules for power electronics applications.
AB - In this paper, an effect of junction temperature swings (ΔTj) on reliability of IGBT modules is studied with 600 V, 30 A, transfer molded power modules. This study is based on power cycling test results of 18 IGBT modules under three different junction temperature swings, namely 40 °C, 60 °C and 70 °C, by means of an advanced power cycler. The advanced power cycler allows performing power cycling tests under similar conditions of IGBT modules in power electronics applications. This paper presents post-failure analysis of the tested IGBT modules of interest in order to investigate the failure mechanism and also to compare results under different Tj. Further, a lifetime factor in respect to ΔTj is modeled with different lifetime definitions and confidence levels. This paper enables a better understanding of the junction temperature swing-related failure mechanisms and reliability performance of transfer molded IGBT modules for power electronics applications.
UR - https://www.scopus.com/pages/publications/85054012167
U2 - 10.1016/j.microrel.2018.07.002
DO - 10.1016/j.microrel.2018.07.002
M3 - Article
AN - SCOPUS:85054012167
SN - 0026-2714
VL - 88-90
SP - 788
EP - 794
JO - Microelectronics Reliability
JF - Microelectronics Reliability
ER -