Abstract
Abstract: To achieve bondlines with improved heat resistance and thermal conductance during operation, pressure-assisted sinter-bonding was performed in air with bimodal Ag-coated Cu particles for die attachment of the next-generation power devices composed of SiC. The bonding temperature and pressure were 250 °C and 10 MPa, respectively, and the sizes of the bimodal particles were 2 µm and 350 nm. After a short bonding time of 10 min, a paste with a 6:4 mixing ratio showed an average shear strength of > 20 MPa. The dewetting of Ag shells on the particles and void filling by the 350 nm particles induced rapid sintering. Graphic Abstract: [Figure not available: see fulltext.].
| Original language | English |
|---|---|
| Pages (from-to) | 293-298 |
| Number of pages | 6 |
| Journal | Electronic Materials Letters |
| Volume | 16 |
| Issue number | 3 |
| DOIs | |
| State | Published - 1 May 2020 |
Keywords
- Ag dewetting
- Ag-coated
- Bimodal particle
- Cu particle
- Shear strength
- Sinter-bonding