Proposal for Improved Electrical Efficiency through Thermal Modeling of Interconnect Structure

This study investigated the modeling of heat and current distribution in interconnect structure used in semiconductor systems based on their shapes, utilizing Finite Element Method (FEM) simulations. Through experimental validation, the research aims to optimize power efficiency in interconnect structures. It identifies issues such as increased current density due to reduced contact area between metal lines and vias and temperature rise from Joule heating. The findings provide insights into considerations for reliably scaling down interconnect structures in semiconductor systems and can be widely applied to research aimed at enhancing reliability.