TY - GEN
T1 - Rapid, low cost fabrication of circular cross-section microchannels by thermal air molding
AU - Nguyen, Thanh Qua
AU - Park, Woo Tae
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/2/26
Y1 - 2015/2/26
N2 - This paper demonstrates a simple fabrication process of polydimethylsiloxane (PDMS) circular cross section microfluidic channels by using a PDMS master mold and thermal air molding. Based on this technique, circular cross section microchannel can be easily produced in a wide range of dimensions from 10 μm to 500 μm with simple bench top equipment. This technique can create perfect circular channels without any plasma activated bonding and alignment process. We can also apply this technique to fabricate circular shape microchannel network for mimicking the vascular system, micro concaves for spheroid culture, micro nozzles for droplet generation, and micro patch clamps for cell immobilization.
AB - This paper demonstrates a simple fabrication process of polydimethylsiloxane (PDMS) circular cross section microfluidic channels by using a PDMS master mold and thermal air molding. Based on this technique, circular cross section microchannel can be easily produced in a wide range of dimensions from 10 μm to 500 μm with simple bench top equipment. This technique can create perfect circular channels without any plasma activated bonding and alignment process. We can also apply this technique to fabricate circular shape microchannel network for mimicking the vascular system, micro concaves for spheroid culture, micro nozzles for droplet generation, and micro patch clamps for cell immobilization.
UR - http://www.scopus.com/inward/record.url?scp=84931053404&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2015.7050960
DO - 10.1109/MEMSYS.2015.7050960
M3 - Conference contribution
AN - SCOPUS:84931053404
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 348
EP - 350
BT - 2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015
Y2 - 18 January 2015 through 22 January 2015
ER -