Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

Jong Hwan Park; Jong Hyun Lee; Yong Ho Lee; Yong Seog Kim

doi:10.1007/s11664-002-0007-9

Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

Jong Hwan Park, Jong Hyun Lee, Yong Ho Lee, Yong Seog Kim

Dept. of Materials Science & Engineering

Hongik University

Research output: Contribution to journal › Article › peer-review

21 Scopus citations

Abstract

The reaction characteristics of molten Au/Sn eutectic solder with potential diffusion-barrier materials of optoelectronic packages were investigated. The characteristics were studied by reflowing the solder on Pt, Ni, and Co plates, respectively, and by measuring the thickness of the reaction product. In addition, the dissolution rate of Pt into the solder was measured. The results indicated that Pt, which is commonly used as the diffusion-barrier layer in the under-bump metallurgy (UBM) of optoelectronic packages, reacts readily with the molten solder, resulting in discontinuous reaction products at the solder/Pt interface. Cobalt, on the other hand, reacted with the solder at an order of magnitude slower rate than that of Pt and provided an effective barrier against the reaction with the solder.

Original language	English
Pages (from-to)	1175-1180
Number of pages	6
Journal	Journal of Electronic Materials
Volume	31
Issue number	11
DOIs	https://doi.org/10.1007/s11664-002-0007-9
State	Published - Nov 2002

Keywords

Au/Sn
Co
Interface reaction
Pt
UBM

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10.1007/s11664-002-0007-9

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title = "Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages",

abstract = "The reaction characteristics of molten Au/Sn eutectic solder with potential diffusion-barrier materials of optoelectronic packages were investigated. The characteristics were studied by reflowing the solder on Pt, Ni, and Co plates, respectively, and by measuring the thickness of the reaction product. In addition, the dissolution rate of Pt into the solder was measured. The results indicated that Pt, which is commonly used as the diffusion-barrier layer in the under-bump metallurgy (UBM) of optoelectronic packages, reacts readily with the molten solder, resulting in discontinuous reaction products at the solder/Pt interface. Cobalt, on the other hand, reacted with the solder at an order of magnitude slower rate than that of Pt and provided an effective barrier against the reaction with the solder.",

keywords = "Au/Sn, Co, Interface reaction, Pt, UBM",

author = "Park, \{Jong Hwan\} and Lee, \{Jong Hyun\} and Lee, \{Yong Ho\} and Kim, \{Yong Seog\}",

year = "2002",

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AU - Park, Jong Hwan

AU - Lee, Jong Hyun

AU - Lee, Yong Ho

AU - Kim, Yong Seog

PY - 2002/11

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N2 - The reaction characteristics of molten Au/Sn eutectic solder with potential diffusion-barrier materials of optoelectronic packages were investigated. The characteristics were studied by reflowing the solder on Pt, Ni, and Co plates, respectively, and by measuring the thickness of the reaction product. In addition, the dissolution rate of Pt into the solder was measured. The results indicated that Pt, which is commonly used as the diffusion-barrier layer in the under-bump metallurgy (UBM) of optoelectronic packages, reacts readily with the molten solder, resulting in discontinuous reaction products at the solder/Pt interface. Cobalt, on the other hand, reacted with the solder at an order of magnitude slower rate than that of Pt and provided an effective barrier against the reaction with the solder.

AB - The reaction characteristics of molten Au/Sn eutectic solder with potential diffusion-barrier materials of optoelectronic packages were investigated. The characteristics were studied by reflowing the solder on Pt, Ni, and Co plates, respectively, and by measuring the thickness of the reaction product. In addition, the dissolution rate of Pt into the solder was measured. The results indicated that Pt, which is commonly used as the diffusion-barrier layer in the under-bump metallurgy (UBM) of optoelectronic packages, reacts readily with the molten solder, resulting in discontinuous reaction products at the solder/Pt interface. Cobalt, on the other hand, reacted with the solder at an order of magnitude slower rate than that of Pt and provided an effective barrier against the reaction with the solder.

KW - Au/Sn

KW - Co

KW - Interface reaction

KW - Pt

KW - UBM

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Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

Abstract

Keywords

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