Reaction Characteristics of the In-15Pb-5Ag Solder with a Au/Ni/Cu Pad and Their Effects on Mechanical Properties

Jong Hyun Lee; Yong Seong Eom; Kwang Seong Choi; Byung Seok Choi; Ho Gyeong Yoon; Jong Tae Moon; Yong Seog Kim

doi:10.1007/s11664-004-0133-7

Reaction Characteristics of the In-15Pb-5Ag Solder with a Au/Ni/Cu Pad and Their Effects on Mechanical Properties

Jong Hyun Lee, Yong Seong Eom, Kwang Seong Choi, Byung Seok Choi, Ho Gyeong Yoon, Jong Tae Moon, Yong Seog Kim

Dept. of Materials Science & Engineering

Research output: Contribution to journal › Article › peer-review

6 Scopus citations

Abstract

Reaction characteristics of the In-15Pb-5Ag (wt.%) solder with a Au/Ni/Cu pad during reflow soldering and aging treatment were examined. Interfacial reaction during reflow resulted in either an AuIn₂ or Ni ₂₈In₇₂ layer, depending on reflow time. The AuIn ₂ layer became thinner and disappeared from the interface, and only the Ni₂₈In₇₂ layer grew with the progress of aging treatment at 130°C. Based on those observations, the dissolution rate of the Au top layer was estimated, and the behavior of the AuIn₂ layer during reflow and aging treatment was discussed. In addition, peak shear load and fracture energy of the solder bump were measured as a function of reflow time and aging treatment. The results were compared with those measured with the Sn-37Pb solder bump.

Original language	English
Pages (from-to)	277-282
Number of pages	6
Journal	Journal of Electronic Materials
Volume	33
Issue number	4
DOIs	https://doi.org/10.1007/s11664-004-0133-7
State	Published - Apr 2004

Keywords

Aging
Au dissolution
Au embrittlement
In-15Pb-5Ag solder
Reflow

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10.1007/s11664-004-0133-7

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title = "Reaction Characteristics of the In-15Pb-5Ag Solder with a Au/Ni/Cu Pad and Their Effects on Mechanical Properties",

abstract = "Reaction characteristics of the In-15Pb-5Ag (wt.\%) solder with a Au/Ni/Cu pad during reflow soldering and aging treatment were examined. Interfacial reaction during reflow resulted in either an AuIn2 or Ni 28In72 layer, depending on reflow time. The AuIn 2 layer became thinner and disappeared from the interface, and only the Ni28In72 layer grew with the progress of aging treatment at 130°C. Based on those observations, the dissolution rate of the Au top layer was estimated, and the behavior of the AuIn2 layer during reflow and aging treatment was discussed. In addition, peak shear load and fracture energy of the solder bump were measured as a function of reflow time and aging treatment. The results were compared with those measured with the Sn-37Pb solder bump.",

keywords = "Aging, Au dissolution, Au embrittlement, In-15Pb-5Ag solder, Reflow",

author = "Lee, \{Jong Hyun\} and Eom, \{Yong Seong\} and Choi, \{Kwang Seong\} and Choi, \{Byung Seok\} and Yoon, \{Ho Gyeong\} and Moon, \{Jong Tae\} and Kim, \{Yong Seog\}",

year = "2004",

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doi = "10.1007/s11664-004-0133-7",

language = "English",

volume = "33",

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journal = "Journal of Electronic Materials",

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T1 - Reaction Characteristics of the In-15Pb-5Ag Solder with a Au/Ni/Cu Pad and Their Effects on Mechanical Properties

AU - Lee, Jong Hyun

AU - Eom, Yong Seong

AU - Choi, Kwang Seong

AU - Choi, Byung Seok

AU - Yoon, Ho Gyeong

AU - Moon, Jong Tae

AU - Kim, Yong Seog

PY - 2004/4

Y1 - 2004/4

N2 - Reaction characteristics of the In-15Pb-5Ag (wt.%) solder with a Au/Ni/Cu pad during reflow soldering and aging treatment were examined. Interfacial reaction during reflow resulted in either an AuIn2 or Ni 28In72 layer, depending on reflow time. The AuIn 2 layer became thinner and disappeared from the interface, and only the Ni28In72 layer grew with the progress of aging treatment at 130°C. Based on those observations, the dissolution rate of the Au top layer was estimated, and the behavior of the AuIn2 layer during reflow and aging treatment was discussed. In addition, peak shear load and fracture energy of the solder bump were measured as a function of reflow time and aging treatment. The results were compared with those measured with the Sn-37Pb solder bump.

AB - Reaction characteristics of the In-15Pb-5Ag (wt.%) solder with a Au/Ni/Cu pad during reflow soldering and aging treatment were examined. Interfacial reaction during reflow resulted in either an AuIn2 or Ni 28In72 layer, depending on reflow time. The AuIn 2 layer became thinner and disappeared from the interface, and only the Ni28In72 layer grew with the progress of aging treatment at 130°C. Based on those observations, the dissolution rate of the Au top layer was estimated, and the behavior of the AuIn2 layer during reflow and aging treatment was discussed. In addition, peak shear load and fracture energy of the solder bump were measured as a function of reflow time and aging treatment. The results were compared with those measured with the Sn-37Pb solder bump.

KW - Aging

KW - Au dissolution

KW - Au embrittlement

KW - In-15Pb-5Ag solder

KW - Reflow

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JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 4

ER -

Reaction Characteristics of the In-15Pb-5Ag Solder with a Au/Ni/Cu Pad and Their Effects on Mechanical Properties

Abstract

Keywords

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