Reflow characteristics of Sn-Ag matrix in-situ composite solders

Jong Hyun Lee; Dea Jin Park; Jung Na Heo; Yong Ho Lee; Dong Hyuk Shin; Yong Seog Kim

doi:10.1016/S1359-6462(99)00392-9

Reflow characteristics of Sn-Ag matrix in-situ composite solders

Jong Hyun Lee, Dea Jin Park, Jung Na Heo, Yong Ho Lee, Dong Hyuk Shin, Yong Seog Kim

Dept. of Materials Science & Engineering

Research output: Contribution to journal › Article › peer-review

38 Scopus citations

Abstract

In this study, copper powders were added into a molten Sn-Ag solder to form in-situ Cu6Sn5 disperoids. The composite solder formed more uniform and thinner intermetallic layer at the solder/Cu contact pad interface. However, the disperoids coarsened very significantly during the reflow processing and their gravitational sedimentation was observed.

Original language	English
Pages (from-to)	827-831
Number of pages	5
Journal	Scripta Materialia
Volume	42
Issue number	8
DOIs	https://doi.org/10.1016/S1359-6462(99)00392-9
State	Published - 31 Mar 2000

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title = "Reflow characteristics of Sn-Ag matrix in-situ composite solders",

abstract = "In this study, copper powders were added into a molten Sn-Ag solder to form in-situ Cu6Sn5 disperoids. The composite solder formed more uniform and thinner intermetallic layer at the solder/Cu contact pad interface. However, the disperoids coarsened very significantly during the reflow processing and their gravitational sedimentation was observed.",

author = "Lee, \{Jong Hyun\} and Park, \{Dea Jin\} and Heo, \{Jung Na\} and Lee, \{Yong Ho\} and Shin, \{Dong Hyuk\} and Kim, \{Yong Seog\}",

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AU - Lee, Jong Hyun

AU - Park, Dea Jin

AU - Heo, Jung Na

AU - Lee, Yong Ho

AU - Shin, Dong Hyuk

AU - Kim, Yong Seog

PY - 2000/3/31

Y1 - 2000/3/31

N2 - In this study, copper powders were added into a molten Sn-Ag solder to form in-situ Cu6Sn5 disperoids. The composite solder formed more uniform and thinner intermetallic layer at the solder/Cu contact pad interface. However, the disperoids coarsened very significantly during the reflow processing and their gravitational sedimentation was observed.

AB - In this study, copper powders were added into a molten Sn-Ag solder to form in-situ Cu6Sn5 disperoids. The composite solder formed more uniform and thinner intermetallic layer at the solder/Cu contact pad interface. However, the disperoids coarsened very significantly during the reflow processing and their gravitational sedimentation was observed.

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U2 - 10.1016/S1359-6462(99)00392-9

DO - 10.1016/S1359-6462(99)00392-9

M3 - Article

AN - SCOPUS:0342906506

SN - 1359-6462

VL - 42

SP - 827

EP - 831

JO - Scripta Materialia

JF - Scripta Materialia

IS - 8

ER -

Reflow characteristics of Sn-Ag matrix in-situ composite solders

Abstract

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