Reliability of composite solder bumps produced by an in-situ process

Jong Hyun Lee; Daejin Park; Jong Tae Moon; Yong Ho Lee; Dong Hyuk Shin; Yong Seog Kim

doi:10.1007/s11664-000-0022-7

Reliability of composite solder bumps produced by an in-situ process

Jong Hyun Lee, Daejin Park, Jong Tae Moon, Yong Ho Lee, Dong Hyuk Shin, Yong Seog Kim

Dept. of Materials Science & Engineering

Research output: Contribution to journal › Article › peer-review

20 Scopus citations

Abstract

In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu₆Sn₅ dispersoids was investigated for its thermal stability. The stability was evaluated mainly by measuring the growth rate of intermetallics at in-situ composite solder/BLM interface as a function of the number of reflow soldering cycles and aging time. The rates were compared with those of the eutectic Pb-Sn and Sn-Ag solders. After the thermal treatments, the solder joints were tested for their shear strengths. The results indicated that the in-situ composite solder has a higher shear strength and better thermal stability than the eutectic Pb-Sn solder.

Original language	English
Pages (from-to)	1264-1269
Number of pages	6
Journal	Journal of Electronic Materials
Volume	29
Issue number	10
DOIs	https://doi.org/10.1007/s11664-000-0022-7
State	Published - Oct 2000

Access to Document

10.1007/s11664-000-0022-7

Cite this

@article{8606b4aa332c4e4dbf96039c09c09e9c,

title = "Reliability of composite solder bumps produced by an in-situ process",

abstract = "In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu6Sn5 dispersoids was investigated for its thermal stability. The stability was evaluated mainly by measuring the growth rate of intermetallics at in-situ composite solder/BLM interface as a function of the number of reflow soldering cycles and aging time. The rates were compared with those of the eutectic Pb-Sn and Sn-Ag solders. After the thermal treatments, the solder joints were tested for their shear strengths. The results indicated that the in-situ composite solder has a higher shear strength and better thermal stability than the eutectic Pb-Sn solder.",

author = "Lee, \{Jong Hyun\} and Daejin Park and Moon, \{Jong Tae\} and Lee, \{Yong Ho\} and Shin, \{Dong Hyuk\} and Kim, \{Yong Seog\}",

year = "2000",

month = oct,

doi = "10.1007/s11664-000-0022-7",

language = "English",

volume = "29",

pages = "1264--1269",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

number = "10",

}

TY - JOUR

T1 - Reliability of composite solder bumps produced by an in-situ process

AU - Lee, Jong Hyun

AU - Park, Daejin

AU - Moon, Jong Tae

AU - Lee, Yong Ho

AU - Shin, Dong Hyuk

AU - Kim, Yong Seog

PY - 2000/10

Y1 - 2000/10

N2 - In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu6Sn5 dispersoids was investigated for its thermal stability. The stability was evaluated mainly by measuring the growth rate of intermetallics at in-situ composite solder/BLM interface as a function of the number of reflow soldering cycles and aging time. The rates were compared with those of the eutectic Pb-Sn and Sn-Ag solders. After the thermal treatments, the solder joints were tested for their shear strengths. The results indicated that the in-situ composite solder has a higher shear strength and better thermal stability than the eutectic Pb-Sn solder.

AB - In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu6Sn5 dispersoids was investigated for its thermal stability. The stability was evaluated mainly by measuring the growth rate of intermetallics at in-situ composite solder/BLM interface as a function of the number of reflow soldering cycles and aging time. The rates were compared with those of the eutectic Pb-Sn and Sn-Ag solders. After the thermal treatments, the solder joints were tested for their shear strengths. The results indicated that the in-situ composite solder has a higher shear strength and better thermal stability than the eutectic Pb-Sn solder.

UR - http://www.scopus.com/inward/record.url?scp=0034297520&partnerID=8YFLogxK

U2 - 10.1007/s11664-000-0022-7

DO - 10.1007/s11664-000-0022-7

M3 - Article

AN - SCOPUS:0034297520

SN - 0361-5235

VL - 29

SP - 1264

EP - 1269

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 10

ER -

Reliability of composite solder bumps produced by an in-situ process

Abstract

Access to Document

Other files and links

Fingerprint

Cite this