Sinter-Bonding Characteristics in Air of Decomposable Sheet Material Containing Bimodal-Sized Cu@Ag Particles for Die Attachment in High-Heat-Flux Devices

A sheet-type sinter-bonding material was developed to form thermally stable and highly heat-conductive joints suitable for wide-bandgap (WBG) semiconductor dies and high-heat-flux devices, and its bonding characteristics were investigated. To enhance the cost-competitiveness of the bonding material, Ag-coated Cu (Cu@Ag) particles were employed as fillers instead of conventional Ag particles. To facilitate accelerated sintering, a bimodal particle size distribution comprising several micron- and submicron-sized particles was adopted by synthesizing and mixing both size ranges. For sheet fabrication, a decomposable resin was used as the essential binder component, which could be removed during the bonding process via thermal decomposition. This approach enabled the formation of a sintered bond line composed entirely of Cu@Ag particles. Thermogravimetric and differential thermal analyses revealed that the decomposition of the resin in the sheet occurred within the temperature range of 290–340 °C. Consequently, sinter-bonding conducted at 350 °C and 370 °C exhibited significantly superior bondability compared to bonding at 330 °C. In particular, sinter-bonding at 350 °C for just 60 s resulted in a highly densified joint microstructure with a low porosity of 7.6% and high shear strength exceeding 25 MPa. The formation of the bond line was initiated by sintering between the outer Ag shells of the adjacent particles. However, with increasing bonding time or temperature, sintering driven by Cu diffusion from the particle cores to the outer Ag shells, particularly in the submicron-sized particles, was progressively enhanced. These results obtained from the fabricated sheet-type materials demonstrate that, even with the use of resin, rapid solid-state sintering between filler particles combined with the removal of resin through decomposition enables the formation of a metallic bond line with excellent thermal conductivity.