Sintering characteristics of micro-Zn paste containing Sn-3.0Ag-0.5Cu nanoparticles

Sang Soo Chee, Jong Hyun Lee

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

The transient liquid-phase sintering behavior of micro-Zn/nano-Sn-3.0Ag-0.5Cu (SAC) pastes was examined at a temperature of 190 °C as a function of the volume of ultrafine (~12.4 nm) SAC nanoparticles present. SAC nanoparticles have lower melting point drop than the bulk SAC particles. Although successful linkage at the interface between all Zn particles was not accomplished in all sintered samples, the number of linkages increased marginally with a decrease in the SAC content. As a result, the electrical resistivity of the sintered samples decreased with the decrease in the SAC content; however, the resistivities were still very high in all samples. Microstructural observations indicated that the observed results were mainly due to the short lifespan of the liquid phase caused by the coarsening of SAC nanoparticles during heating.

Original languageEnglish
Title of host publicationApplied Mechanics and Mechanical Engineering III
Pages939-944
Number of pages6
DOIs
StatePublished - 2013
Event2012 3rd International Conference on Applied Mechanics and Mechanical Engineering, ICAMME 2012 - Macau, China
Duration: 14 Nov 201215 Nov 2012

Publication series

NameApplied Mechanics and Materials
Volume249-250
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Conference

Conference2012 3rd International Conference on Applied Mechanics and Mechanical Engineering, ICAMME 2012
Country/TerritoryChina
CityMacau
Period14/11/1215/11/12

Keywords

  • Electrical resistivity
  • Liquid-phase sintering
  • Melting point
  • Micro-zn paste
  • Sn-3.0Ag-0.5Cu nanoparticles

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