Smart Mechanical Structures and Design for Advanced Adhesives: A Review

Jaeil Kim, Geonjun Choi, Seongjin Park, Minwook Kim, Kwangjun Kim, Ho Sup Jung, Moon Kyu Kwak, Jong G. Ok, Hoon Eui Jeong

Research output: Contribution to journalReview articlepeer-review

1 Scopus citations

Abstract

Smart adhesives with engineered mechanical structures have emerged as a transformative technology with broad applications in fields such as wearable healthcare devices, bioengineering, and soft robotics. By integrating advanced mechanical architectures like kirigami, tessellations, and multilayered designs, these adhesives exhibit enhanced surface and mechanical properties that lead to superior interfacial adhesion. Such designs offer critical advantages—improved stretchability, substrate conformability, and increased adhesion strength—over conventional adhesives. This review explores the range of engineered structures used in smart adhesives and demonstrates how these innovations address the limitations of traditional adhesives. Additionally, we discuss their applications in wearable healthcare devices, flexible electronics, and robotics.

Original languageEnglish
Pages (from-to)757-772
Number of pages16
JournalInternational Journal of Precision Engineering and Manufacturing
Volume26
Issue number3
DOIs
StatePublished - Mar 2025

Keywords

  • Engineered mechanical structure
  • Kirigami
  • Multilayer adhesive
  • Smart adhesive
  • Tessellation

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