Solder bump deposition using a laser beam

Wonsuk Choi; Jea Woon Kim; Jong Hyeong Kim; Joohan Kim

doi:10.3795/KSME-A.2012.36.1.037

Solder bump deposition using a laser beam

Wonsuk Choi, Jea Woon Kim, Jong Hyeong Kim, Joohan Kim

Seoul National University of Science and Technology (SNUST)

Research output: Contribution to journal › Article › peer-review

Abstract

LIFT (laser-induced forward transfer) is an advanced laser processing method used for selectively transferring micron-sized objects. In our study, this process was applied in order to deposit solder balls in microsystem packaging processes for electronics. Locally melted solder paste could be transferred to a rigid substrate using laser pulses. A thin glass plate with a solder cream layer was used as a donor film, and an IR laser pulse (wavelength = 1070 nm) was used to transfer a micron-sized solder ball to the receptor. Mass balance and energy balance were applied to analyze the shape and temperature profiles of the solder paste drops. The transferred solder bumps had measured diameters of 30-40 μm and thicknesses of 50 μm in our experiment. The limits and applications of this method are also presented.

Original language	English
Pages (from-to)	37-42
Number of pages	6
Journal	Transactions of the Korean Society of Mechanical Engineers, A
Volume	36
Issue number	1
DOIs	https://doi.org/10.3795/KSME-A.2012.36.1.037
State	Published - Jan 2012

Keywords

IR laser
Material transferd
Solder ball

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10.3795/KSME-A.2012.36.1.037

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abstract = "LIFT (laser-induced forward transfer) is an advanced laser processing method used for selectively transferring micron-sized objects. In our study, this process was applied in order to deposit solder balls in microsystem packaging processes for electronics. Locally melted solder paste could be transferred to a rigid substrate using laser pulses. A thin glass plate with a solder cream layer was used as a donor film, and an IR laser pulse (wavelength = 1070 nm) was used to transfer a micron-sized solder ball to the receptor. Mass balance and energy balance were applied to analyze the shape and temperature profiles of the solder paste drops. The transferred solder bumps had measured diameters of 30-40 μm and thicknesses of 50 μm in our experiment. The limits and applications of this method are also presented.",

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AB - LIFT (laser-induced forward transfer) is an advanced laser processing method used for selectively transferring micron-sized objects. In our study, this process was applied in order to deposit solder balls in microsystem packaging processes for electronics. Locally melted solder paste could be transferred to a rigid substrate using laser pulses. A thin glass plate with a solder cream layer was used as a donor film, and an IR laser pulse (wavelength = 1070 nm) was used to transfer a micron-sized solder ball to the receptor. Mass balance and energy balance were applied to analyze the shape and temperature profiles of the solder paste drops. The transferred solder bumps had measured diameters of 30-40 μm and thicknesses of 50 μm in our experiment. The limits and applications of this method are also presented.

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Solder bump deposition using a laser beam

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Keywords

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