Specimen alignment in an axial tensile test of thin films using direct imaging and its influence on the mechanical properties of BeCu

This paper proposes a new system for verification of the alignment of loading fixtures and test specimens during tensile testing of thin film with a micrometer size through direct imaging. The novel and reliable image recognition system to evaluate the misalignment between the load train and the specimen axes during tensile test of thin film was developed using digital image processing technology with CCD. The decision of whether alignment of the tensile specimen is acceptable or not is based on a probabilistic analysis through the edge feature extraction of digital imaging. In order to verify the performance of the proposed system and investigate the effect of the misalignment of the specimen on tensile properties, the tensile tests were performed as displacement control in air and at room temperature for metal thin film, the beryllium copper (BeCu) alloys. In the case of the metal thin films, bending stresses caused by misalignment are insignificant because the films are easily bent during tensile tests to eliminate the bending stresses. And it was observed that little effects and scatters on tensile properties occur by stress gradient caused by twisting at in-plane misalignment, and the effects and scatters on tensile properties are insignificant at out-of-plane misalignment, in the case of the BeCu thin film.