SrTiO3 thin film growth by atomic layer deposition using Ti(O-iPr)2(thd)2, Sr(thd)2, and H2O

Sang Woon Lee, Oh Seong Kwon, Jeong Hwan Han, Cheol Seong Hwang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

SrTiO3 (STO) thin films were deposited by atomic-layer- deposition (ALD) at a higher temperature (370°C) using Ti(O-iPr) 2(thd)2 and Sr(thd)2 as Ti-, and Sr-precursors, respectively, and H2O as the oxidant, in order to improve the crystallinity and film density. With these precursors, the ALD process window of the STO film could be extended up to 400°C. With the help of a seed-layer, more dense and well-crystallized STO films could be obtained even in the as-deposited state. The adoption of a seed-layer and the seed-layer annealing temperature are the crucial factors for obtaining high capacitance. In the case of a planar capacitor structure consisting of Pt/STO (27nm)/Ru(bottom), an equivalent oxide thickness of 0.73nm and leakage current density of 1×10-7 A/cm2 at 1V were achieved.

Original languageEnglish
Title of host publicationECS Transactions - Symposium on Silicon Nitride, Silicon Dioxide Thin Insulating Films, and Emerging Dielectrics
PublisherElectrochemical Society Inc.
Pages87-97
Number of pages11
Edition3
ISBN (Electronic)9781566775526
ISBN (Print)9781566775526
DOIs
StatePublished - 2007
EventSymposium on Silicon Nitride, Silicon Dioxide Thin Insulating Films, and Emerging Dielectrics - 211th ECS Meeting - Chicago, IL, United States
Duration: 6 May 200711 May 2007

Publication series

NameECS Transactions
Number3
Volume6
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceSymposium on Silicon Nitride, Silicon Dioxide Thin Insulating Films, and Emerging Dielectrics - 211th ECS Meeting
Country/TerritoryUnited States
CityChicago, IL
Period6/05/0711/05/07

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