Stress analysis of stacked Si wafer in 3D WLP
- Ki Ho Maeng
- , Youngrae Kim
- , Sung Geun Kang
- , Sung Dong Kim
- , Sarah Eunkyung Kim
- Seoul National University of Science and Technology (SNUST)
- Microsystem Packaging Center
Research output: Contribution to journal › Article › peer-review
4
Scopus
citations