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Stress analysis of stacked Si wafer in 3D WLP
Ki Ho Maeng
, Youngrae Kim
, Sung Geun Kang
,
Sung Dong Kim
,
Sarah Eunkyung Kim
Dept. of Mechanical System and Design Engineering
Dept. of Semiconductor Engineering
Seoul National University of Science and Technology (SNUST)
Microsystem Packaging Center
Research output
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Article
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peer-review
3
Scopus citations
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Material Science
Film
100%
Stress Analysis
100%
Delamination
50%
Transmission Electron Microscopy
50%
Mechanical Stress
50%
Stress Measurement
50%