TY - JOUR
T1 - Study of a low-temperature bonding process for a next-generation flexible display module using transverse ultrasound
AU - Kim, Jong Hyeong
AU - Ji, Myeong Gu
AU - Song, Chun Sam
AU - Kim, Joo Hyun
PY - 2012/4
Y1 - 2012/4
N2 - Abstract This is direct bonding many of the metal bumps between FPCB and HPCB substrate. By using an ultrasonic horn mounted on an ultrasonic bonding machine, it is possible to bond gold pads onto the FPCB and HPCB at room temperature without an adhesive like ACA or NCA and high heat and solder. This ultrasonic bonding technology minimizes damage to the material. The process conditions evaluated for obtaining a greater bonding strength than 0.6 kgf, which is commercially required, were 40 kHz of frequency; 0.6MPa of bonding pressure; and 0.5, 1.0, 1.5, and 2.0 s of bonding time. The peel off test was performed for evaluating bonding strength, which was found to be more than 0.80 kgf.
AB - Abstract This is direct bonding many of the metal bumps between FPCB and HPCB substrate. By using an ultrasonic horn mounted on an ultrasonic bonding machine, it is possible to bond gold pads onto the FPCB and HPCB at room temperature without an adhesive like ACA or NCA and high heat and solder. This ultrasonic bonding technology minimizes damage to the material. The process conditions evaluated for obtaining a greater bonding strength than 0.6 kgf, which is commercially required, were 40 kHz of frequency; 0.6MPa of bonding pressure; and 0.5, 1.0, 1.5, and 2.0 s of bonding time. The peel off test was performed for evaluating bonding strength, which was found to be more than 0.80 kgf.
KW - Display module
KW - FPCB
KW - Low temperature bonding
KW - Metal bump direct bonding
KW - Ultrasonic bonding
UR - https://www.scopus.com/pages/publications/84859938142
U2 - 10.3795/KSME-A.2012.36.4.395
DO - 10.3795/KSME-A.2012.36.4.395
M3 - Article
AN - SCOPUS:84859938142
SN - 1226-4873
VL - 36
SP - 395
EP - 403
JO - Transactions of the Korean Society of Mechanical Engineers, A
JF - Transactions of the Korean Society of Mechanical Engineers, A
IS - 4
ER -