Sub-1 min Sinter-Bonding Technique in Air Using Modified Cu Dendritic Particles for Formation of a High-Temperature Sustainable Bondline

Eun Byeol Choi; Jong Hyun Lee

doi:10.1007/s12540-020-00806-6

Sub-1 min Sinter-Bonding Technique in Air Using Modified Cu Dendritic Particles for Formation of a High-Temperature Sustainable Bondline

Eun Byeol Choi, Jong Hyun Lee

Dept. of Materials Science & Engineering

Seoul National University of Science and Technology (SNUST)

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

Abstract: A pressure-assisted sinter-bonding technique in air using modified Cu dendritic particles is suggested to obtain a high-temperature sustainable bondline for wide band-gap power devices. The combination of void filling by the bending deformation of stems in the dendritic particles, prompt sintering of nanonodules on the surfaces of the particles, and generation of fresh Cu by in situ reduction on surfaces of the particles exhibited extremely rapid sinter bonding. A die attached under 10 MPa for 10 s at 300 °C and under 5 MPa for 60 s at 350 °C demonstrated shear strength of 26.2 and 20.6 MPa, respectively, surpassing that of a die attached using Pb–5Sn. Graphic Abstract: [Figure not available: see fulltext.].

Original language	English
Pages (from-to)	5278-5284
Number of pages	7
Journal	Metals and Materials International
Volume	27
Issue number	12
DOIs	https://doi.org/10.1007/s12540-020-00806-6
State	Published - Dec 2021

Keywords

Bending deformation
Cu dendritic particle
Nanonodule
Shear strength
Sinter-bonding

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10.1007/s12540-020-00806-6

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@article{9647b3487b45423f86ccdfc31c6d4c19,

title = "Sub-1 min Sinter-Bonding Technique in Air Using Modified Cu Dendritic Particles for Formation of a High-Temperature Sustainable Bondline",

abstract = "Abstract: A pressure-assisted sinter-bonding technique in air using modified Cu dendritic particles is suggested to obtain a high-temperature sustainable bondline for wide band-gap power devices. The combination of void filling by the bending deformation of stems in the dendritic particles, prompt sintering of nanonodules on the surfaces of the particles, and generation of fresh Cu by in situ reduction on surfaces of the particles exhibited extremely rapid sinter bonding. A die attached under 10 MPa for 10 s at 300 °C and under 5 MPa for 60 s at 350 °C demonstrated shear strength of 26.2 and 20.6 MPa, respectively, surpassing that of a die attached using Pb–5Sn. Graphic Abstract: [Figure not available: see fulltext.].",

keywords = "Bending deformation, Cu dendritic particle, Nanonodule, Shear strength, Sinter-bonding",

author = "Choi, \{Eun Byeol\} and Lee, \{Jong Hyun\}",

note = "Publisher Copyright: {\textcopyright} 2020, The Korean Institute of Metals and Materials.",

year = "2021",

month = dec,

doi = "10.1007/s12540-020-00806-6",

language = "English",

volume = "27",

pages = "5278--5284",

journal = "Metals and Materials International",

issn = "1598-9623",

number = "12",

}

TY - JOUR

T1 - Sub-1 min Sinter-Bonding Technique in Air Using Modified Cu Dendritic Particles for Formation of a High-Temperature Sustainable Bondline

AU - Choi, Eun Byeol

AU - Lee, Jong Hyun

PY - 2021/12

Y1 - 2021/12

N2 - Abstract: A pressure-assisted sinter-bonding technique in air using modified Cu dendritic particles is suggested to obtain a high-temperature sustainable bondline for wide band-gap power devices. The combination of void filling by the bending deformation of stems in the dendritic particles, prompt sintering of nanonodules on the surfaces of the particles, and generation of fresh Cu by in situ reduction on surfaces of the particles exhibited extremely rapid sinter bonding. A die attached under 10 MPa for 10 s at 300 °C and under 5 MPa for 60 s at 350 °C demonstrated shear strength of 26.2 and 20.6 MPa, respectively, surpassing that of a die attached using Pb–5Sn. Graphic Abstract: [Figure not available: see fulltext.].

AB - Abstract: A pressure-assisted sinter-bonding technique in air using modified Cu dendritic particles is suggested to obtain a high-temperature sustainable bondline for wide band-gap power devices. The combination of void filling by the bending deformation of stems in the dendritic particles, prompt sintering of nanonodules on the surfaces of the particles, and generation of fresh Cu by in situ reduction on surfaces of the particles exhibited extremely rapid sinter bonding. A die attached under 10 MPa for 10 s at 300 °C and under 5 MPa for 60 s at 350 °C demonstrated shear strength of 26.2 and 20.6 MPa, respectively, surpassing that of a die attached using Pb–5Sn. Graphic Abstract: [Figure not available: see fulltext.].

KW - Bending deformation

KW - Cu dendritic particle

KW - Nanonodule

KW - Shear strength

KW - Sinter-bonding

UR - https://www.scopus.com/pages/publications/85087952403

U2 - 10.1007/s12540-020-00806-6

DO - 10.1007/s12540-020-00806-6

M3 - Article

AN - SCOPUS:85087952403

SN - 1598-9623

VL - 27

SP - 5278

EP - 5284

JO - Metals and Materials International

JF - Metals and Materials International

IS - 12

ER -

Sub-1 min Sinter-Bonding Technique in Air Using Modified Cu Dendritic Particles for Formation of a High-Temperature Sustainable Bondline

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Keywords

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