@inproceedings{9849962894274ef2998b1e4bdc20cd0a,
title = "Sub-mm encapsulated accelerometers: A fully implantable sensor for cochlear implants",
abstract = "In this paper, we present for the first time a submillimeter sized fully packaged accelerometer as an alternative sensor for use in cochlear implants and middle ear implants. The sensor is as small as 387×387×230μm and weighs approximately 100μg. This miniaturization is realized by utilizing an advanced packaging scheme using a thick film encapsulation with epi-polysilicon. The sensor is attached on the middle ear ossicles and measures the vibration transmitted from the tympanic membrane due to the sound in the ear canal. In this study, the sensor is fully characterized on a human cadaveric temporal bone preparation.",
keywords = "Accelerometer, Cochlear implant, Epi-poly Encapsulation",
author = "Park, \{Woo Tae\} and O'Connor, \{Kevin N.\} and Mallon, \{Joseph R.\} and Toshiki Maetani and Candler, \{Rob N.\} and Vipin Ayanoor-Vitikkate and Roberson, \{Joseph B.\} and Sunil Puria and Kenny, \{Thomas W.\}",
year = "2005",
language = "English",
isbn = "0780389948",
series = "Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05",
pages = "109--112",
booktitle = "TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers",
note = "13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 ; Conference date: 05-06-2005 Through 09-06-2005",
}