Sub-THz transceiver design for future generation mobile communications

Giovanni Mangravit; Cedric Dehos; Vincent Puyal; Olivier Richard; Ghita Yaakoubi Khbiza; Francesco Foglia Manzillo; Xuan Viet Linh Nguyen; Francesco Filice; Ettore Noccetti; Pierre Louis Hellier; Florence Podevin; Sylvain Bourdel; Andrea Ruffino; Kyung Sik Choi; Basem Abdelaziz Abdelmagid; Mohamed Eleraky; Hua Wang; Bertrand Ardouin; Tom K. Johansen; Luca Fanori; Qiuting Huang; Erich Schlaffer; Piet Wambacq; Dominique Morche; Björn Debaillie

Sub-THz transceiver design for future generation mobile communications

Giovanni Mangravit
, Cedric Dehos
, Vincent Puyal
, Olivier Richard
, Ghita Yaakoubi Khbiza
, Francesco Foglia Manzillo
, Xuan Viet Linh Nguyen
, Francesco Filice
, Ettore Noccetti
, Pierre Louis Hellier
, Florence Podevin
, Sylvain Bourdel
, Andrea Ruffino
, Kyung Sik Choi
, Basem Abdelaziz Abdelmagid
, Mohamed Eleraky
, Hua Wang
, Bertrand Ardouin
, Tom K. Johansen
, Luca Fanori

Qiuting Huang, Erich Schlaffer, Piet Wambacq, Dominique Morche, Björn Debaillie

Electronic Engineering Program

imec
Commissariat à l’énergie atomique et aux énergies alternatives
University of Pisa
Université Grenoble Alpes
Swiss Federal Institute of Technology Zurich
III-V Lab
Technical University of Denmark
Advanced Circuit Pursuit (ACP)
AT and S
Vrije Universiteit Brussel

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

1 Scopus citations

Abstract

This paper outlines the design considerations necessary to realize an innovative transceiver prototype for future-generation mobile communication, adeptly harnessing the spectrum beyond 100 GHz. The primary innovations and challenges reside in maximizing the efficacy of BiCMOS and indium phosphide technologies, advanced radio frequency (RF) packaging, and the design of high-performance D-band RF frontends. The selection of RF-chip technologies and the integration of densely packed RF packaging are thoroughly defined and justified. Specifications for both transmitter and receiver systems are derived from a meticulous link budget analysis. These preliminary studies and decisions inform the forthcoming tape-outs in this project. The focus remains on developing key transceiver technologies to drive the next generation of mobile communications, surpassing the capabilities of 5G. This includes enhancing data rates, power efficiency, integration density, and minimizing footprint.

Original language	English
Title of host publication	Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications
Publisher	River Publishers
Pages	115-132
Number of pages	18
ISBN (Electronic)	9788770046640
ISBN (Print)	9788770046657
State	Published - 22 Aug 2024

Keywords

6G mobile communication
Antenna-in-package
BiMOS integrated circuits
InP
Integrated circuit packaging
Millimeter wave integrated
Mobile communication
Phased arrays
Receivers
Transmitters

Cite this

Mangravit, G., Dehos, C., Puyal, V., Richard, O., Yaakoubi Khbiza, G., Foglia Manzillo, F., Nguyen, X. V. L., Filice, F., Noccetti, E., Hellier, P. L., Podevin, F., Bourdel, S., Ruffino, A., Choi, K. S., Abdelaziz Abdelmagid, B., Eleraky, M., Wang, H., Ardouin, B., Johansen, T. K., ... Debaillie, B. (2024). Sub-THz transceiver design for future generation mobile communications. In Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications (pp. 115-132). River Publishers.

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title = "Sub-THz transceiver design for future generation mobile communications",

abstract = "This paper outlines the design considerations necessary to realize an innovative transceiver prototype for future-generation mobile communication, adeptly harnessing the spectrum beyond 100 GHz. The primary innovations and challenges reside in maximizing the efficacy of BiCMOS and indium phosphide technologies, advanced radio frequency (RF) packaging, and the design of high-performance D-band RF frontends. The selection of RF-chip technologies and the integration of densely packed RF packaging are thoroughly defined and justified. Specifications for both transmitter and receiver systems are derived from a meticulous link budget analysis. These preliminary studies and decisions inform the forthcoming tape-outs in this project. The focus remains on developing key transceiver technologies to drive the next generation of mobile communications, surpassing the capabilities of 5G. This includes enhancing data rates, power efficiency, integration density, and minimizing footprint.",

keywords = "6G mobile communication, Antenna-in-package, BiMOS integrated circuits, InP, Integrated circuit packaging, Millimeter wave integrated, Mobile communication, Phased arrays, Receivers, Transmitters",

author = "Giovanni Mangravit and Cedric Dehos and Vincent Puyal and Olivier Richard and \{Yaakoubi Khbiza\}, Ghita and \{Foglia Manzillo\}, Francesco and Nguyen, \{Xuan Viet Linh\} and Francesco Filice and Ettore Noccetti and Hellier, \{Pierre Louis\} and Florence Podevin and Sylvain Bourdel and Andrea Ruffino and Choi, \{Kyung Sik\} and \{Abdelaziz Abdelmagid\}, Basem and Mohamed Eleraky and Hua Wang and Bertrand Ardouin and Johansen, \{Tom K.\} and Luca Fanori and Qiuting Huang and Erich Schlaffer and Piet Wambacq and Dominique Morche and Bj{\"o}rn Debaillie",

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year = "2024",

month = aug,

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language = "English",

isbn = "9788770046657",

pages = "115--132",

booktitle = "Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications",

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Mangravit, G, Dehos, C, Puyal, V, Richard, O, Yaakoubi Khbiza, G, Foglia Manzillo, F, Nguyen, XVL, Filice, F, Noccetti, E, Hellier, PL, Podevin, F, Bourdel, S, Ruffino, A, Choi, KS, Abdelaziz Abdelmagid, B, Eleraky, M, Wang, H, Ardouin, B, Johansen, TK, Fanori, L, Huang, Q, Schlaffer, E, Wambacq, P, Morche, D & Debaillie, B 2024, Sub-THz transceiver design for future generation mobile communications. in Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications. River Publishers, pp. 115-132.

TY - CHAP

T1 - Sub-THz transceiver design for future generation mobile communications

AU - Mangravit, Giovanni

AU - Dehos, Cedric

AU - Puyal, Vincent

AU - Richard, Olivier

AU - Yaakoubi Khbiza, Ghita

AU - Foglia Manzillo, Francesco

AU - Nguyen, Xuan Viet Linh

AU - Filice, Francesco

AU - Noccetti, Ettore

AU - Hellier, Pierre Louis

AU - Podevin, Florence

AU - Bourdel, Sylvain

AU - Ruffino, Andrea

AU - Choi, Kyung Sik

AU - Abdelaziz Abdelmagid, Basem

AU - Eleraky, Mohamed

AU - Wang, Hua

AU - Ardouin, Bertrand

AU - Johansen, Tom K.

AU - Fanori, Luca

AU - Huang, Qiuting

AU - Schlaffer, Erich

AU - Wambacq, Piet

AU - Morche, Dominique

AU - Debaillie, Björn

PY - 2024/8/22

Y1 - 2024/8/22

N2 - This paper outlines the design considerations necessary to realize an innovative transceiver prototype for future-generation mobile communication, adeptly harnessing the spectrum beyond 100 GHz. The primary innovations and challenges reside in maximizing the efficacy of BiCMOS and indium phosphide technologies, advanced radio frequency (RF) packaging, and the design of high-performance D-band RF frontends. The selection of RF-chip technologies and the integration of densely packed RF packaging are thoroughly defined and justified. Specifications for both transmitter and receiver systems are derived from a meticulous link budget analysis. These preliminary studies and decisions inform the forthcoming tape-outs in this project. The focus remains on developing key transceiver technologies to drive the next generation of mobile communications, surpassing the capabilities of 5G. This includes enhancing data rates, power efficiency, integration density, and minimizing footprint.

AB - This paper outlines the design considerations necessary to realize an innovative transceiver prototype for future-generation mobile communication, adeptly harnessing the spectrum beyond 100 GHz. The primary innovations and challenges reside in maximizing the efficacy of BiCMOS and indium phosphide technologies, advanced radio frequency (RF) packaging, and the design of high-performance D-band RF frontends. The selection of RF-chip technologies and the integration of densely packed RF packaging are thoroughly defined and justified. Specifications for both transmitter and receiver systems are derived from a meticulous link budget analysis. These preliminary studies and decisions inform the forthcoming tape-outs in this project. The focus remains on developing key transceiver technologies to drive the next generation of mobile communications, surpassing the capabilities of 5G. This includes enhancing data rates, power efficiency, integration density, and minimizing footprint.

KW - 6G mobile communication

KW - Antenna-in-package

KW - BiMOS integrated circuits

KW - InP

KW - Integrated circuit packaging

KW - Millimeter wave integrated

KW - Mobile communication

KW - Phased arrays

KW - Receivers

KW - Transmitters

UR - https://www.scopus.com/pages/publications/85204838256

M3 - Chapter

AN - SCOPUS:85204838256

SN - 9788770046657

SP - 115

EP - 132

BT - Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications

PB - River Publishers

ER -

Sub-THz transceiver design for future generation mobile communications

Abstract

Keywords

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