TY - JOUR
T1 - Suppression of flow boiling instabilities and augmentation of thermal performance in a T-shaped microchannel with sudden-expansion flow passages
AU - Choi, Taeho
AU - Kim, Tae Young
N1 - Publisher Copyright:
© 2025 Elsevier Ltd
PY - 2025/12/1
Y1 - 2025/12/1
N2 - Flow boiling in microchannels provides exceptional heat transfer performance but is often compromised by severe flow instability. This study proposes T-shaped microchannels with sudden-expansion flow passages (TMSE) to suppress such instability by controlling the vapor behavior in both vertical and streamwise directions. In the vertical direction, the vapor lift-off from the bottom corner of the upstream T-shaped channel facilitates stable liquid replenishment by preventing the reattachment of growing bubbles. In the streamwise direction, the vapor-venting effect, driven by Laplace pressure gradients induced by asymmetric meniscus curvatures, promotes forward vapor evacuation as slugs encounter the sudden-expansion region. A force balance analysis was conducted to quantitatively verify the effect of vapor venting on flow instability. TMSE was compared with plain surface, plate-fin, and T-shaped microchannels using visualization under heat fluxes from 7 to 170 kW/m2 and mass fluxes of 200, 267, and 334 kg/(m2·s), with HFE-7100 as the working fluid. Plate-fin and T-shaped microchannels exhibited severe vapor backflow across the entire channel, driven by explosive bidirectional vapor growth at an outlet quality of 0.58 and a mass flux of 267 kg/(m2·s). By contrast, the TMSE delayed the vapor backflow regime up to an outlet quality of 0.72. This suppression of vapor backflow enhanced the thermal performance by facilitating stable thin-film evaporation. Consequently, the TMSE achieved a 77.3 % increase in heat transfer coefficients and a 315.7 % improvement in the thermal performance factor compared with T-shaped microchannels, while maintaining pressure-drop levels comparable to those of the plain surface.
AB - Flow boiling in microchannels provides exceptional heat transfer performance but is often compromised by severe flow instability. This study proposes T-shaped microchannels with sudden-expansion flow passages (TMSE) to suppress such instability by controlling the vapor behavior in both vertical and streamwise directions. In the vertical direction, the vapor lift-off from the bottom corner of the upstream T-shaped channel facilitates stable liquid replenishment by preventing the reattachment of growing bubbles. In the streamwise direction, the vapor-venting effect, driven by Laplace pressure gradients induced by asymmetric meniscus curvatures, promotes forward vapor evacuation as slugs encounter the sudden-expansion region. A force balance analysis was conducted to quantitatively verify the effect of vapor venting on flow instability. TMSE was compared with plain surface, plate-fin, and T-shaped microchannels using visualization under heat fluxes from 7 to 170 kW/m2 and mass fluxes of 200, 267, and 334 kg/(m2·s), with HFE-7100 as the working fluid. Plate-fin and T-shaped microchannels exhibited severe vapor backflow across the entire channel, driven by explosive bidirectional vapor growth at an outlet quality of 0.58 and a mass flux of 267 kg/(m2·s). By contrast, the TMSE delayed the vapor backflow regime up to an outlet quality of 0.72. This suppression of vapor backflow enhanced the thermal performance by facilitating stable thin-film evaporation. Consequently, the TMSE achieved a 77.3 % increase in heat transfer coefficients and a 315.7 % improvement in the thermal performance factor compared with T-shaped microchannels, while maintaining pressure-drop levels comparable to those of the plain surface.
KW - Flow boiling
KW - Flow instability
KW - Sudden-expansion
KW - T-shaped microchannels
KW - Vapor anchoring
KW - Vapor lift-off
UR - https://www.scopus.com/pages/publications/105016456811
U2 - 10.1016/j.applthermaleng.2025.128403
DO - 10.1016/j.applthermaleng.2025.128403
M3 - Article
AN - SCOPUS:105016456811
SN - 1359-4311
VL - 280
JO - Applied Thermal Engineering
JF - Applied Thermal Engineering
M1 - 128403
ER -