TY - GEN
T1 - Surface planarization of polymeric interlayer dielectrics for Fowlp applications
AU - Kang, Soojung
AU - Kim, Yejin
AU - Moon, Ayoung
AU - Lee, Sangwon
AU - Kim, Sarah Eunkyung
AU - Kim, Sungdong
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/12
Y1 - 2018/12
N2 - The surface planarity of polymeric interlayer dielectrics becomes a key factor for the multi-level interconnection for fan-out wafer level package. The surface topography of polymeric interlayer dielectrics depends on the underlying metal patterns, and the higher degree of planarization was observed with narrower line and larger space. The pressing method is proposed to flatten the surface undulations. The surface of PBO was pressed with a pressing plate during the soft-bake process, and the surface planarity was observed to be improved effectively.
AB - The surface planarity of polymeric interlayer dielectrics becomes a key factor for the multi-level interconnection for fan-out wafer level package. The surface topography of polymeric interlayer dielectrics depends on the underlying metal patterns, and the higher degree of planarization was observed with narrower line and larger space. The pressing method is proposed to flatten the surface undulations. The surface of PBO was pressed with a pressing plate during the soft-bake process, and the surface planarity was observed to be improved effectively.
UR - https://www.scopus.com/pages/publications/85072291408
U2 - 10.1109/EPTC.2018.8654287
DO - 10.1109/EPTC.2018.8654287
M3 - Conference contribution
AN - SCOPUS:85072291408
T3 - 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
SP - 882
EP - 885
BT - 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th IEEE Electronics Packaging Technology Conference, EPTC 2018
Y2 - 4 December 2018 through 7 December 2018
ER -