TY - GEN
T1 - Tensile properties and drop/shock reliability of Sn-Ag-Cu-In based solder alloys
AU - Yu, A. Mi
AU - Kim, Jun Ki
AU - Lee, Jong Hyun
AU - Kim, Mok Soon
PY - 2009
Y1 - 2009
N2 - Over the past few years, the Sn-3.0(wt.%)Ag-0.5Cu alloy has become a representative Pb-free solder material in the microelectronic packaging industry. However, Sn-3.0Ag-0.5Cu exhibits significantly poorer performance than eutectic Sn-Pb under high strain rate conditions, such as drop testing. It was previously suggested that a quaternary alloy with the composition, Sn-1.2Ag-0.7Cu-0.4In, is a promising candidate for replacing Sn-3.0Ag-0.5Cu. In this study, Mn was chosen as the minor alloying element in a solder alloy with a new formulation, Sn-1.2Ag-0.7Cu-0.4In, to improve its drop/shock reliability. The drop/shock reliability of the newly developed Sn-1.2Ag-0.7Cu-0.4In-Mn Pb-free solder alloy was examined. The drop/shock reliability of this alloy is discussed using the results of the tensile test at various strain rates and compared with that of Sn-1.2Ag-0.7Cu-0.4In, Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu. The results showed that the addition of Mn had a significant effect on the drop/shock reliability.
AB - Over the past few years, the Sn-3.0(wt.%)Ag-0.5Cu alloy has become a representative Pb-free solder material in the microelectronic packaging industry. However, Sn-3.0Ag-0.5Cu exhibits significantly poorer performance than eutectic Sn-Pb under high strain rate conditions, such as drop testing. It was previously suggested that a quaternary alloy with the composition, Sn-1.2Ag-0.7Cu-0.4In, is a promising candidate for replacing Sn-3.0Ag-0.5Cu. In this study, Mn was chosen as the minor alloying element in a solder alloy with a new formulation, Sn-1.2Ag-0.7Cu-0.4In, to improve its drop/shock reliability. The drop/shock reliability of the newly developed Sn-1.2Ag-0.7Cu-0.4In-Mn Pb-free solder alloy was examined. The drop/shock reliability of this alloy is discussed using the results of the tensile test at various strain rates and compared with that of Sn-1.2Ag-0.7Cu-0.4In, Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu. The results showed that the addition of Mn had a significant effect on the drop/shock reliability.
UR - http://www.scopus.com/inward/record.url?scp=77950939608&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2009.5416465
DO - 10.1109/EPTC.2009.5416465
M3 - Conference contribution
AN - SCOPUS:77950939608
SN - 9781424451005
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
SP - 679
EP - 682
BT - EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
T2 - 2009 11th Electronic Packaging Technology Conference, EPTC 2009
Y2 - 9 December 2009 through 11 December 2009
ER -