Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition

A. Mi Yu; Jae Won Jang; Jong Hyun Lee; Jun Ki Kim; Mok Soon Kim

doi:10.1166/jnn.2012.5616

Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition

A. Mi Yu, Jae Won Jang, Jong Hyun Lee, Jun Ki Kim, Mok Soon Kim

Dept. of Materials Science & Engineering

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

The thermal shock reliability and tensile properties of a newly developed quaternary Sn-1.2Ag-0.5Cu-0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn-Ag-Cu based Pb-free solder alloys. It was revealed that the Sn-1.2Ag-0.5Cu-0.4In solder alloy shows better thermal shock reliability compared to the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder alloys. The quaternary alloy has higher strength than Sn-1.0Ag-0.5Cu alloy, and higher elongation than Sn-3.0Ag-0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process

Original language	English
Pages (from-to)	3655-3657
Number of pages	3
Journal	Journal of Nanoscience and Nanotechnology
Volume	12
Issue number	4
DOIs	https://doi.org/10.1166/jnn.2012.5616
State	Published - 2012

Keywords

Indium addition
Pb-free solder
Sn-Ag-Cu alloy
Thermal shock reliability

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10.1166/jnn.2012.5616

Cite this

@article{a6ed812ca4064140a895bc6880b101fd,

title = "Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition",

abstract = "The thermal shock reliability and tensile properties of a newly developed quaternary Sn-1.2Ag-0.5Cu-0.4In (wt\%) solder alloy were investigated and compared to those of ternary Sn-Ag-Cu based Pb-free solder alloys. It was revealed that the Sn-1.2Ag-0.5Cu-0.4In solder alloy shows better thermal shock reliability compared to the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder alloys. The quaternary alloy has higher strength than Sn-1.0Ag-0.5Cu alloy, and higher elongation than Sn-3.0Ag-0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process",

keywords = "Indium addition, Pb-free solder, Sn-Ag-Cu alloy, Thermal shock reliability",

author = "Yu, \{A. Mi\} and Jang, \{Jae Won\} and Lee, \{Jong Hyun\} and Kim, \{Jun Ki\} and Kim, \{Mok Soon\}",

year = "2012",

doi = "10.1166/jnn.2012.5616",

language = "English",

volume = "12",

pages = "3655--3657",

journal = "Journal of Nanoscience and Nanotechnology",

issn = "1533-4880",

publisher = "ASP",

number = "4",

}

TY - JOUR

T1 - Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition

AU - Yu, A. Mi

AU - Jang, Jae Won

AU - Lee, Jong Hyun

AU - Kim, Jun Ki

AU - Kim, Mok Soon

PY - 2012

Y1 - 2012

N2 - The thermal shock reliability and tensile properties of a newly developed quaternary Sn-1.2Ag-0.5Cu-0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn-Ag-Cu based Pb-free solder alloys. It was revealed that the Sn-1.2Ag-0.5Cu-0.4In solder alloy shows better thermal shock reliability compared to the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder alloys. The quaternary alloy has higher strength than Sn-1.0Ag-0.5Cu alloy, and higher elongation than Sn-3.0Ag-0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process

AB - The thermal shock reliability and tensile properties of a newly developed quaternary Sn-1.2Ag-0.5Cu-0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn-Ag-Cu based Pb-free solder alloys. It was revealed that the Sn-1.2Ag-0.5Cu-0.4In solder alloy shows better thermal shock reliability compared to the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder alloys. The quaternary alloy has higher strength than Sn-1.0Ag-0.5Cu alloy, and higher elongation than Sn-3.0Ag-0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process

KW - Indium addition

KW - Pb-free solder

KW - Sn-Ag-Cu alloy

KW - Thermal shock reliability

UR - https://www.scopus.com/pages/publications/84863312596

U2 - 10.1166/jnn.2012.5616

DO - 10.1166/jnn.2012.5616

M3 - Article

AN - SCOPUS:84863312596

SN - 1533-4880

VL - 12

SP - 3655

EP - 3657

JO - Journal of Nanoscience and Nanotechnology

JF - Journal of Nanoscience and Nanotechnology

IS - 4

ER -

Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition

Abstract

Keywords

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