The Advanced DC Circuit Model for Hybrid bonding in Dual Damascene Structures

As the miniaturization of devices and advancements in process technology have reached their limits, hybrid bonding has emerged as a new solution for fine-pitch processes in 3D bonding methods. Hybrid bonded structures vary in type and shape depending on the process. It became necessary to develop a new DC circuit model that could accurately capture the magnitude and trends of total resistance in these diverse structures. In particular, we designed a resistance model for structures utilizing the dual damascene process, a new method that allows easy adjustment of resistance and current by controlling the number of vias. Additionally, one of the most important methods for evaluating bonding quality in hybrid bonding is the extraction of contact resistance. This model includes contact resistance in the interface, which provides the necessary information for accurate contact resistance extraction. The accuracy of the SPICE model was measured against FEM simulations based on dimensional analysis. Initially, there was a significant discrepancy between the FEM simulation and the proposed model. However, by incorporating correction factors to compensate for current density bias, we were able to reduce the error to less than 3%, resulting in a highly accurate model.