The effect of the addition of in on the reaction and mechanical properties of Sn-1.0Ag-0.5Cu solder alloy

A. Mi Yu; Chang Woo Lee; Mok Soon Kim; Jong Hyun Lee

doi:10.1007/BF03027912

The effect of the addition of in on the reaction and mechanical properties of Sn-1.0Ag-0.5Cu solder alloy

A. Mi Yu, Chang Woo Lee, Mok Soon Kim, Jong Hyun Lee

Dept. of Materials Science & Engineering

Research output: Contribution to journal › Article › peer-review

27 Scopus citations

Abstract

The effects of the reduction of the Ag content and the addition of In on the mechanical properties, soldering characteristics and reaction behavior at solder/package interfaces are investigated in this study. It was found that the addition of In significantly improved the wettability of the solder at reflow temperatures ranging from 230 °C to 240 °C. Moreover, the addition also improves the elongation of the solder alloy, thereby increasing the toughness of the alloy. With the optimization of the In and Ag contents, a Sn-Ag-Cu-In quaternary alloy would be a strong candidate to replace the Sn-3.0Ag-0.5Cu composition.

Original language	English
Pages (from-to)	517-520
Number of pages	4
Journal	Metals and Materials International
Volume	13
Issue number	6
DOIs	https://doi.org/10.1007/BF03027912
State	Published - Dec 2007

Keywords

Elongation
Pb-free solder
Sn-Ag-Cu-In alloy
Toughness
Wettability

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10.1007/BF03027912

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title = "The effect of the addition of in on the reaction and mechanical properties of Sn-1.0Ag-0.5Cu solder alloy",

abstract = "The effects of the reduction of the Ag content and the addition of In on the mechanical properties, soldering characteristics and reaction behavior at solder/package interfaces are investigated in this study. It was found that the addition of In significantly improved the wettability of the solder at reflow temperatures ranging from 230 °C to 240 °C. Moreover, the addition also improves the elongation of the solder alloy, thereby increasing the toughness of the alloy. With the optimization of the In and Ag contents, a Sn-Ag-Cu-In quaternary alloy would be a strong candidate to replace the Sn-3.0Ag-0.5Cu composition.",

keywords = "Elongation, Pb-free solder, Sn-Ag-Cu-In alloy, Toughness, Wettability",

author = "Yu, \{A. Mi\} and Lee, \{Chang Woo\} and Kim, \{Mok Soon\} and Lee, \{Jong Hyun\}",

year = "2007",

month = dec,

doi = "10.1007/BF03027912",

language = "English",

volume = "13",

pages = "517--520",

journal = "Metals and Materials International",

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T1 - The effect of the addition of in on the reaction and mechanical properties of Sn-1.0Ag-0.5Cu solder alloy

AU - Yu, A. Mi

AU - Lee, Chang Woo

AU - Kim, Mok Soon

AU - Lee, Jong Hyun

PY - 2007/12

Y1 - 2007/12

N2 - The effects of the reduction of the Ag content and the addition of In on the mechanical properties, soldering characteristics and reaction behavior at solder/package interfaces are investigated in this study. It was found that the addition of In significantly improved the wettability of the solder at reflow temperatures ranging from 230 °C to 240 °C. Moreover, the addition also improves the elongation of the solder alloy, thereby increasing the toughness of the alloy. With the optimization of the In and Ag contents, a Sn-Ag-Cu-In quaternary alloy would be a strong candidate to replace the Sn-3.0Ag-0.5Cu composition.

AB - The effects of the reduction of the Ag content and the addition of In on the mechanical properties, soldering characteristics and reaction behavior at solder/package interfaces are investigated in this study. It was found that the addition of In significantly improved the wettability of the solder at reflow temperatures ranging from 230 °C to 240 °C. Moreover, the addition also improves the elongation of the solder alloy, thereby increasing the toughness of the alloy. With the optimization of the In and Ag contents, a Sn-Ag-Cu-In quaternary alloy would be a strong candidate to replace the Sn-3.0Ag-0.5Cu composition.

KW - Elongation

KW - Pb-free solder

KW - Sn-Ag-Cu-In alloy

KW - Toughness

KW - Wettability

UR - https://www.scopus.com/pages/publications/38349185014

U2 - 10.1007/BF03027912

DO - 10.1007/BF03027912

M3 - Article

AN - SCOPUS:38349185014

SN - 1598-9623

VL - 13

SP - 517

EP - 520

JO - Metals and Materials International

JF - Metals and Materials International

IS - 6

ER -

The effect of the addition of in on the reaction and mechanical properties of Sn-1.0Ag-0.5Cu solder alloy

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Keywords

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