The Effects of UBM and SnAgCu Solder on Drop Impact Reliability of Wafer Level Package

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Cite this

@article{bb192f06917c48019b615df405f90139,

title = "The Effects of UBM and SnAgCu Solder on Drop Impact Reliability of Wafer Level Package",

author = "Kim, {Sung Dong}",

year = "2010",

month = sep,

language = "Korean",

volume = "17",

journal = "마이크로전자 및 패키징학회지",

issn = "1226-9360",

publisher = "한국마이크로전자및패키징학회",

number = "3",

}