The properties of ZrO2 film deposition by ALD at low temperature

Byung Chan Yang, Jeong Woo Shin, Hyuk Dong Kwon, Jihwan An

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

ZrO2 film is widely used for high-k applications and also has good mechanical properties. This paper covers the study of the properties of ZrO2 film deposited by atomic layer deposition (ALD) using TEMA Zr and water in the temperature range of 110 to 250oC for potential application in flexible-device fabrication. At a low deposition temperature, ALD ZrO2 films showed a uniform growth rate of ~1 å per cycle, good uniformity, partial crystallinity, and smooth surface. ZrO2 can also be deposited on the trench structure with a high aspect ratio (~1:50), but conformality needs to be improved for practical applications.

Original languageEnglish
Pages (from-to)735-738
Number of pages4
JournalJournal of the Korean Society for Precision Engineering
Volume34
Issue number10
DOIs
StatePublished - Oct 2017

Keywords

  • Atomic layer deposition
  • Low-temperature deposition
  • Thin film
  • ZrO

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