Abstract
ZrO2 film is widely used for high-k applications and also has good mechanical properties. This paper covers the study of the properties of ZrO2 film deposited by atomic layer deposition (ALD) using TEMA Zr and water in the temperature range of 110 to 250oC for potential application in flexible-device fabrication. At a low deposition temperature, ALD ZrO2 films showed a uniform growth rate of ~1 å per cycle, good uniformity, partial crystallinity, and smooth surface. ZrO2 can also be deposited on the trench structure with a high aspect ratio (~1:50), but conformality needs to be improved for practical applications.
| Original language | English |
|---|---|
| Pages (from-to) | 735-738 |
| Number of pages | 4 |
| Journal | Journal of the Korean Society for Precision Engineering |
| Volume | 34 |
| Issue number | 10 |
| DOIs | |
| State | Published - Oct 2017 |
Keywords
- Atomic layer deposition
- Low-temperature deposition
- Thin film
- ZrO