Thermal cycling effects on critical adhesion energy and residual stress in benzocyclobutene-bonded wafers

Engineering

• Residual Stress 100%
• Thermal Cycle 50%
• Peak Temperature 50%
• Chemical Vapor Deposition 50%
• Vapor Deposition 50%
• Point Bending 25%
• Silicon Wafer 25%
• Room Temperature 25%
• Silicon Dioxide 25%
• Condensation Reaction 25%
• Sio2 Film 25%

Material Science

• Residual Stress 100%
• Thermal Cycling 100%
• Film 40%
• Plasma-Enhanced Chemical Vapor Deposition 40%
• Silicon Dioxide 20%
• Glass Transition Temperature 20%
• Silicon Wafer 20%