TY - JOUR
T1 - Thermal-fluid coupled analysis for injection molding process by considering thermal contact resistance
AU - Sohn, Dong Hwi
AU - Kim, Kyung Min
AU - Park, Keun
PY - 2011/12
Y1 - 2011/12
N2 - Injection molds are generally fabricated by assembling a number of plates in which the core and cavity components are assembled. This assembled structure has a number of contact interfaces where the heat transfer characteristics are affected by thermal contact resistance. In previous studies, numerical approaches were investigated to predict the effect of thermal contact resistance on the temperature distribution of injection molds. In this study, thermal-fluid coupled numerical analyses are performed to take into account the thermal contact effect on the numerical evaluation of the mold filling characteristics. Comparisons with experimental results show that the proposed coupled analysis provides more reliable results than the conventional analyses in predicting the mold filling characteristics by taking into account the effect of thermal contact resistance inside the injection mold assembly.
AB - Injection molds are generally fabricated by assembling a number of plates in which the core and cavity components are assembled. This assembled structure has a number of contact interfaces where the heat transfer characteristics are affected by thermal contact resistance. In previous studies, numerical approaches were investigated to predict the effect of thermal contact resistance on the temperature distribution of injection molds. In this study, thermal-fluid coupled numerical analyses are performed to take into account the thermal contact effect on the numerical evaluation of the mold filling characteristics. Comparisons with experimental results show that the proposed coupled analysis provides more reliable results than the conventional analyses in predicting the mold filling characteristics by taking into account the effect of thermal contact resistance inside the injection mold assembly.
KW - Injection Molding
KW - Numerical Analysis
KW - Thermal Contact Resistance
KW - Thermal-Fluid Coupled Analysis
UR - http://www.scopus.com/inward/record.url?scp=84255205305&partnerID=8YFLogxK
U2 - 10.3795/KSME-A.2011.35.12.1627
DO - 10.3795/KSME-A.2011.35.12.1627
M3 - Article
AN - SCOPUS:84255205305
SN - 1226-4873
VL - 35
SP - 1627
EP - 1633
JO - Transactions of the Korean Society of Mechanical Engineers, A
JF - Transactions of the Korean Society of Mechanical Engineers, A
IS - 12
ER -