Thermally robust HfNx-based bidirectional diode and its integration with RRAM for crossbar array application

Ha Young Lee, Ju Hwan Park, Seok Choi, Byung Joon Choi

Research output: Contribution to journalArticlepeer-review

Abstract

High-density nonvolatile memories can be realized by fabricating resistive random-access memories (RRAMs) as 4F2 (F: minimum feature size) cells in a crossbar array (CBA) configuration. However, the CBA configuration induces leakage currents in the nearby cells, which significantly reduces the read-out margin and limits the CBA size extension. One solution to this problem is to integrate an RRAM with a bidirectional selector. Research on the various type of selector devices has been extensively explored so far, however, a device that satisfies all requirements has not been developed. In this paper, we propose a novel bidirectional diode selector with a Pt/HfNx/Pt stack. We implement a one-selector–one-resistor configuration in a 10 × 10 CBA by integrating Pt/HfNx/Pt with a Ti/HfO2/Pt RRAM stack. We confirm the stable resistive switching operation and good thermal stability of the selector and its integrated device. Chemical analyses aided by Auger electron spectroscopy and X-ray photoelectron spectroscopy reveal the gradient-oxidation of the HfNx film, which explains the nonlinear and asymmetric current–voltage characteristics. This novel nonlinear selector with simple structure and high thermal stability can be applied to build CBAs for high-density nonvolatile memories or neuromorphic computing elements, in the future.

Original languageEnglish
Article number481
JournalApplied Physics A: Materials Science and Processing
Volume130
Issue number7
DOIs
StatePublished - Jul 2024

Keywords

  • Atomic layer deposition
  • Crossbar array
  • Hafnium nitride
  • Resistive random-access memory
  • Selector
  • Thermal stability

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