Thermo-mechanical behavior of MEMS gyroscope sensor package subjected to temperature change

Jin Won Joo; Yong Chul Cho; Jonghwa Won; Sung Hoon Choa

doi:10.4028/0-87849-413-8.227

Thermo-mechanical behavior of MEMS gyroscope sensor package subjected to temperature change

Jin Won Joo, Yong Chul Cho, Jonghwa Won, Sung Hoon Choa

Dept. of Semiconductor Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

In this paper, deformation behavior of the MEMS gyroscope package subjected to temperature change is investigated using a high-sensitivity moiré interferometry. Temperature dependent analyses of warpage and extension/contraction of the package are presented. Detailed global and local deformations of the package by temperature change are investigated and its effect on the frequency shift of the MEMS gyroscope is studied.

Original language	English
Pages (from-to)	227-230
Number of pages	4
Journal	Key Engineering Materials
Volume	324-325 I
DOIs	https://doi.org/10.4028/0-87849-413-8.227
State	Published - 2006

Keywords

MEMS gyroscope package
Moiré interferometry
Thermo-mechanical behavior

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10.4028/0-87849-413-8.227

Cite this

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title = "Thermo-mechanical behavior of MEMS gyroscope sensor package subjected to temperature change",

abstract = "In this paper, deformation behavior of the MEMS gyroscope package subjected to temperature change is investigated using a high-sensitivity moir{\'e} interferometry. Temperature dependent analyses of warpage and extension/contraction of the package are presented. Detailed global and local deformations of the package by temperature change are investigated and its effect on the frequency shift of the MEMS gyroscope is studied.",

keywords = "MEMS gyroscope package, Moir{\'e} interferometry, Thermo-mechanical behavior",

author = "Joo, \{Jin Won\} and Cho, \{Yong Chul\} and Jonghwa Won and Choa, \{Sung Hoon\}",

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AU - Cho, Yong Chul

AU - Won, Jonghwa

AU - Choa, Sung Hoon

PY - 2006

Y1 - 2006

N2 - In this paper, deformation behavior of the MEMS gyroscope package subjected to temperature change is investigated using a high-sensitivity moiré interferometry. Temperature dependent analyses of warpage and extension/contraction of the package are presented. Detailed global and local deformations of the package by temperature change are investigated and its effect on the frequency shift of the MEMS gyroscope is studied.

AB - In this paper, deformation behavior of the MEMS gyroscope package subjected to temperature change is investigated using a high-sensitivity moiré interferometry. Temperature dependent analyses of warpage and extension/contraction of the package are presented. Detailed global and local deformations of the package by temperature change are investigated and its effect on the frequency shift of the MEMS gyroscope is studied.

KW - MEMS gyroscope package

KW - Moiré interferometry

KW - Thermo-mechanical behavior

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SN - 1013-9826

VL - 324-325 I

SP - 227

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JO - Key Engineering Materials

JF - Key Engineering Materials

ER -

Thermo-mechanical behavior of MEMS gyroscope sensor package subjected to temperature change

Abstract

Keywords

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