Thin layer laser bonding using spin-on-glass materials

Joohan Kim; Hyangtae Kim; Jae Hoon Lee

doi:10.1016/j.apsusc.2008.04.093

Thin layer laser bonding using spin-on-glass materials

Joohan Kim, Hyangtae Kim, Jae Hoon Lee

Dept. of Mechanical & Automotive Engineering

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

We developed and characterized a new laser bonding process with a nano adhesive layer for transparent materials. The adhesive is spin-coated on a glass substrate and cured locally with a focused laser beam. The minimum viscosity of the adhesive is very low, so that a thin layer only a few hundred nanometers thick can be coated on a cover substrate. Laser irradiation from a Nd:YAG laser system with a wavelength of 1064 nm is employed as the curing source for the localized nano layer bonding process. The measured thickness of the bonding layer is in the range of 400 nm to 3 μm. This process can be applied to the nano or micro bonding of various transparent systems such as flat panel displays, biochips, and heat-sensitive microelectronics. We present experimental results and discuss the process characteristics.

Original language	English
Pages (from-to)	6842-6848
Number of pages	7
Journal	Applied Surface Science
Volume	254
Issue number	21
DOIs	https://doi.org/10.1016/j.apsusc.2008.04.093
State	Published - 30 Aug 2008

Keywords

Laser bonding
Micro device
Spin-on-glass

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10.1016/j.apsusc.2008.04.093

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abstract = "We developed and characterized a new laser bonding process with a nano adhesive layer for transparent materials. The adhesive is spin-coated on a glass substrate and cured locally with a focused laser beam. The minimum viscosity of the adhesive is very low, so that a thin layer only a few hundred nanometers thick can be coated on a cover substrate. Laser irradiation from a Nd:YAG laser system with a wavelength of 1064 nm is employed as the curing source for the localized nano layer bonding process. The measured thickness of the bonding layer is in the range of 400 nm to 3 μm. This process can be applied to the nano or micro bonding of various transparent systems such as flat panel displays, biochips, and heat-sensitive microelectronics. We present experimental results and discuss the process characteristics.",

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N2 - We developed and characterized a new laser bonding process with a nano adhesive layer for transparent materials. The adhesive is spin-coated on a glass substrate and cured locally with a focused laser beam. The minimum viscosity of the adhesive is very low, so that a thin layer only a few hundred nanometers thick can be coated on a cover substrate. Laser irradiation from a Nd:YAG laser system with a wavelength of 1064 nm is employed as the curing source for the localized nano layer bonding process. The measured thickness of the bonding layer is in the range of 400 nm to 3 μm. This process can be applied to the nano or micro bonding of various transparent systems such as flat panel displays, biochips, and heat-sensitive microelectronics. We present experimental results and discuss the process characteristics.

AB - We developed and characterized a new laser bonding process with a nano adhesive layer for transparent materials. The adhesive is spin-coated on a glass substrate and cured locally with a focused laser beam. The minimum viscosity of the adhesive is very low, so that a thin layer only a few hundred nanometers thick can be coated on a cover substrate. Laser irradiation from a Nd:YAG laser system with a wavelength of 1064 nm is employed as the curing source for the localized nano layer bonding process. The measured thickness of the bonding layer is in the range of 400 nm to 3 μm. This process can be applied to the nano or micro bonding of various transparent systems such as flat panel displays, biochips, and heat-sensitive microelectronics. We present experimental results and discuss the process characteristics.

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KW - Spin-on-glass

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Thin layer laser bonding using spin-on-glass materials

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