@inproceedings{1e5a6a19260f48d480777522eca502aa,
title = "Three-dimensional (3D) ICs: A technology platform for integrated systems and opportunities for new polymeric adhesives",
abstract = "Three-dimensional (3D) ICs offer increased performance of digital ICs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3D integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare{\texttrademark}, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.",
author = "Gutmann, \{R. J.\} and Lu, \{J. Q.\} and Y. Kwon and McDonald, \{J. F.\} and Cale, \{T. S.\}",
year = "2001",
language = "English",
isbn = "0780372204",
series = "First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics",
pages = "173--180",
booktitle = "First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics",
note = "First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001) ; Conference date: 21-10-2001 Through 24-10-2001",
}
