Three-dimensional (3D) ICs: A technology platform for integrated systems and opportunities for new polymeric adhesives

R. J. Gutmann; J. Q. Lu; Y. Kwon; J. F. McDonald; T. S. Cale

Three-dimensional (3D) ICs: A technology platform for integrated systems and opportunities for new polymeric adhesives

R. J. Gutmann
, J. Q. Lu
, Y. Kwon
, J. F. McDonald
, T. S. Cale

Dept. of Chemical and Biomolecular Engineering

Rensselaer Polytechnic Institute

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

38 Scopus citations

Abstract

Three-dimensional (3D) ICs offer increased performance of digital ICs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3D integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare™, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.

Original language	English
Title of host publication	First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
Subtitle of host publication	Incoperating POLY, PEP and Adhasives in Electronics
Pages	173-180
Number of pages	8
State	Published - 2001
Event	First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001) - Potsdam, Germany Duration: 21 Oct 2001 → 24 Oct 2001

Publication series

Name	First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Conference

Conference	First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001)
Country/Territory	Germany
City	Potsdam
Period	21/10/01 → 24/10/01

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Cite this

Gutmann, R. J., Lu, J. Q., Kwon, Y., McDonald, J. F., & Cale, T. S. (2001). Three-dimensional (3D) ICs: A technology platform for integrated systems and opportunities for new polymeric adhesives. In First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics (pp. 173-180). (First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics).

Gutmann, R. J. ; Lu, J. Q. ; Kwon, Y. et al. / Three-dimensional (3D) ICs : A technology platform for integrated systems and opportunities for new polymeric adhesives. First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics. 2001. pp. 173-180 (First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics).

@inproceedings{1e5a6a19260f48d480777522eca502aa,

title = "Three-dimensional (3D) ICs: A technology platform for integrated systems and opportunities for new polymeric adhesives",

abstract = "Three-dimensional (3D) ICs offer increased performance of digital ICs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3D integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare{\texttrademark}, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.",

author = "Gutmann, \{R. J.\} and Lu, \{J. Q.\} and Y. Kwon and McDonald, \{J. F.\} and Cale, \{T. S.\}",

year = "2001",

language = "English",

isbn = "0780372204",

series = "First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics",

pages = "173--180",

booktitle = "First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics",

note = "First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001) ; Conference date: 21-10-2001 Through 24-10-2001",

}

Gutmann, RJ, Lu, JQ, Kwon, Y, McDonald, JF & Cale, TS 2001, Three-dimensional (3D) ICs: A technology platform for integrated systems and opportunities for new polymeric adhesives. in First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics. First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics, pp. 173-180, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001), Potsdam, Germany, 21/10/01.

Three-dimensional (3D) ICs: A technology platform for integrated systems and opportunities for new polymeric adhesives. / Gutmann, R. J.; Lu, J. Q.; Kwon, Y. et al.
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics. 2001. p. 173-180 (First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Three-dimensional (3D) ICs

T2 - First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001)

AU - Gutmann, R. J.

AU - Lu, J. Q.

AU - Kwon, Y.

AU - McDonald, J. F.

AU - Cale, T. S.

PY - 2001

Y1 - 2001

N2 - Three-dimensional (3D) ICs offer increased performance of digital ICs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3D integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare™, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.

AB - Three-dimensional (3D) ICs offer increased performance of digital ICs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3D integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare™, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.

UR - https://www.scopus.com/pages/publications/0035790684

M3 - Conference contribution

AN - SCOPUS:0035790684

SN - 0780372204

T3 - First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

SP - 173

EP - 180

BT - First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics

Y2 - 21 October 2001 through 24 October 2001

ER -

Gutmann RJ, Lu JQ, Kwon Y, McDonald JF, Cale TS. Three-dimensional (3D) ICs: A technology platform for integrated systems and opportunities for new polymeric adhesives. In First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics. 2001. p. 173-180. (First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics).

Three-dimensional (3D) ICs: A technology platform for integrated systems and opportunities for new polymeric adhesives

Abstract

Publication series

Conference

UN SDGs

Other files and links

Fingerprint

Cite this