Abstract
Sn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP) bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles.
| Original language | English |
|---|---|
| Pages (from-to) | 1143-1148 |
| Number of pages | 6 |
| Journal | Archives of Metallurgy and Materials |
| Volume | 62 |
| Issue number | 2 |
| DOIs | |
| State | Published - 1 Jun 2017 |
Keywords
- chip bonding
- immersion plating
- intermetallic compounds (IMC)
- Sn-coated Cu
- transient liquid phase (TLP) sintering