Using MEMS to build the device and the package

B. Kim; M. Hopcroft; C. M. Jha; R. Melamud; S. Chandorkar; M. Agarwal; K. L. Chen; W. T. Park; R. Candler; G. Yama; A. Partridge; M. Lutz; T. W. Kenny

doi:10.1109/SENSOR.2007.4300135

Using MEMS to build the device and the package

B. Kim
, M. Hopcroft
, C. M. Jha
, R. Melamud
, S. Chandorkar
, M. Agarwal
, K. L. Chen
, W. T. Park
, R. Candler
, G. Yama
, A. Partridge
, M. Lutz
, T. W. Kenny

Dept. of Mechanical & Automotive Engineering

Stanford University
Research and Technology Center
SiTime Corporation

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

21 Scopus citations

Abstract

MEMS devices must be packaged to be used. Unfortunately, MEMS packages are challenging to develop, and the packaging of MEMS devices often dominates the cost of the product. In recent years, our group has worked with a team from Bosch to develop and demonstrate a novel wafer-scale encapsulation approach for MEMS. This process uses MEMS fabrication steps to build the device and the package at the same time. The main advantage of this approach is that the wafers emerge from the fabrication facility with all the fragile MEMS structures completely buried within the wafer, allowing all existing standard handling and packaging approaches, such as wafer-dicing, pick/place, and injection mold packaging to be used. This encapsulation process enables CMOS integration, embedding, and extreme miniaturization of complete systems. In this paper, we describe some advantages for performance, size and cost that can come from this approach.

Original language	English
Title of host publication	TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages	331-334
Number of pages	4
DOIs	https://doi.org/10.1109/SENSOR.2007.4300135
State	Published - 2007
Event	4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07 - Lyon, France Duration: 10 Jun 2007 → 14 Jun 2007

Publication series

Name	TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

Conference	4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07
Country/Territory	France
City	Lyon
Period	10/06/07 → 14/06/07

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

Accelerometer
Encapsulation
Packaging
Resonator

Access to Document

10.1109/SENSOR.2007.4300135

Cite this

Kim, B., Hopcroft, M., Jha, C. M., Melamud, R., Chandorkar, S., Agarwal, M., Chen, K. L., Park, W. T., Candler, R., Yama, G., Partridge, A., Lutz, M., & Kenny, T. W. (2007). Using MEMS to build the device and the package. In TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 331-334). Article 4300135 (TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems). https://doi.org/10.1109/SENSOR.2007.4300135

@inproceedings{c732380b5d45453894f14955626916e9,

title = "Using MEMS to build the device and the package",

abstract = "MEMS devices must be packaged to be used. Unfortunately, MEMS packages are challenging to develop, and the packaging of MEMS devices often dominates the cost of the product. In recent years, our group has worked with a team from Bosch to develop and demonstrate a novel wafer-scale encapsulation approach for MEMS. This process uses MEMS fabrication steps to build the device and the package at the same time. The main advantage of this approach is that the wafers emerge from the fabrication facility with all the fragile MEMS structures completely buried within the wafer, allowing all existing standard handling and packaging approaches, such as wafer-dicing, pick/place, and injection mold packaging to be used. This encapsulation process enables CMOS integration, embedding, and extreme miniaturization of complete systems. In this paper, we describe some advantages for performance, size and cost that can come from this approach.",

keywords = "Accelerometer, Encapsulation, Packaging, Resonator",

author = "B. Kim and M. Hopcroft and Jha, \{C. M.\} and R. Melamud and S. Chandorkar and M. Agarwal and Chen, \{K. L.\} and Park, \{W. T.\} and R. Candler and G. Yama and A. Partridge and M. Lutz and Kenny, \{T. W.\}",

year = "2007",

doi = "10.1109/SENSOR.2007.4300135",

language = "English",

isbn = "1424408423",

series = "TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems",

pages = "331--334",

booktitle = "TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems",

note = "4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07 ; Conference date: 10-06-2007 Through 14-06-2007",

}

Kim, B, Hopcroft, M, Jha, CM, Melamud, R, Chandorkar, S, Agarwal, M, Chen, KL, Park, WT, Candler, R, Yama, G, Partridge, A, Lutz, M & Kenny, TW 2007, Using MEMS to build the device and the package. in TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems., 4300135, TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems, pp. 331-334, 4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07, Lyon, France, 10/06/07. https://doi.org/10.1109/SENSOR.2007.4300135

Using MEMS to build the device and the package. / Kim, B.; Hopcroft, M.; Jha, C. M. et al.
TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems. 2007. p. 331-334 4300135 (TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Using MEMS to build the device and the package

AU - Kim, B.

AU - Hopcroft, M.

AU - Jha, C. M.

AU - Melamud, R.

AU - Chandorkar, S.

AU - Agarwal, M.

AU - Chen, K. L.

AU - Park, W. T.

AU - Candler, R.

AU - Yama, G.

AU - Partridge, A.

AU - Lutz, M.

AU - Kenny, T. W.

PY - 2007

Y1 - 2007

N2 - MEMS devices must be packaged to be used. Unfortunately, MEMS packages are challenging to develop, and the packaging of MEMS devices often dominates the cost of the product. In recent years, our group has worked with a team from Bosch to develop and demonstrate a novel wafer-scale encapsulation approach for MEMS. This process uses MEMS fabrication steps to build the device and the package at the same time. The main advantage of this approach is that the wafers emerge from the fabrication facility with all the fragile MEMS structures completely buried within the wafer, allowing all existing standard handling and packaging approaches, such as wafer-dicing, pick/place, and injection mold packaging to be used. This encapsulation process enables CMOS integration, embedding, and extreme miniaturization of complete systems. In this paper, we describe some advantages for performance, size and cost that can come from this approach.

AB - MEMS devices must be packaged to be used. Unfortunately, MEMS packages are challenging to develop, and the packaging of MEMS devices often dominates the cost of the product. In recent years, our group has worked with a team from Bosch to develop and demonstrate a novel wafer-scale encapsulation approach for MEMS. This process uses MEMS fabrication steps to build the device and the package at the same time. The main advantage of this approach is that the wafers emerge from the fabrication facility with all the fragile MEMS structures completely buried within the wafer, allowing all existing standard handling and packaging approaches, such as wafer-dicing, pick/place, and injection mold packaging to be used. This encapsulation process enables CMOS integration, embedding, and extreme miniaturization of complete systems. In this paper, we describe some advantages for performance, size and cost that can come from this approach.

KW - Accelerometer

KW - Encapsulation

KW - Packaging

KW - Resonator

UR - https://www.scopus.com/pages/publications/50049119128

U2 - 10.1109/SENSOR.2007.4300135

DO - 10.1109/SENSOR.2007.4300135

M3 - Conference contribution

AN - SCOPUS:50049119128

SN - 1424408423

SN - 9781424408429

T3 - TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

SP - 331

EP - 334

BT - TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

T2 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07

Y2 - 10 June 2007 through 14 June 2007

ER -

Kim B, Hopcroft M, Jha CM, Melamud R, Chandorkar S, Agarwal M et al. Using MEMS to build the device and the package. In TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems. 2007. p. 331-334. 4300135. (TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems). doi: 10.1109/SENSOR.2007.4300135

Using MEMS to build the device and the package

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

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