TY - JOUR
T1 - Wafer bonding using dielectric polymer thin films in 3D integration
AU - Kwon, Y.
AU - Lu, J. Q.
AU - Kraft, R. P.
AU - McDonald, J. F.
AU - Gutmann, R. J.
AU - Cale, T. S.
PY - 2002
Y1 - 2002
N2 - A key process in our approach to monolithic three-dimensional (3D) integration is the bonding of 200-mm wafers using dielectric polymer thin films as bonding glues. After discussing the desired properties of polymer thin films, we describe how bonding protocols are evaluated using silicon and glass wafers. After bonding, the fraction of bonded area was inspected optically and a razor blade method was used to indicate bonding strength. Thermal stability and bonding integrity were evaluated using thermal cycling and backside grinding and polishing. To date, we have studied benzocyclobutene (BCB), Flare™, and methylsilsesquioxane (MSSQ) and Parylene-N as bonding glues. Wafer pairs bonded using BCB showed a larger fraction of bonded area, and those using Flare indicated higher thermal stability. Both BCB and Flare glues provided good bonding integrity after backside grinding tests. Changes in the chemical structures of BCB and Flare glue during bonding were analyzed using FTIR in order to understand the bonding mechanism and to improve the bonding process.
AB - A key process in our approach to monolithic three-dimensional (3D) integration is the bonding of 200-mm wafers using dielectric polymer thin films as bonding glues. After discussing the desired properties of polymer thin films, we describe how bonding protocols are evaluated using silicon and glass wafers. After bonding, the fraction of bonded area was inspected optically and a razor blade method was used to indicate bonding strength. Thermal stability and bonding integrity were evaluated using thermal cycling and backside grinding and polishing. To date, we have studied benzocyclobutene (BCB), Flare™, and methylsilsesquioxane (MSSQ) and Parylene-N as bonding glues. Wafer pairs bonded using BCB showed a larger fraction of bonded area, and those using Flare indicated higher thermal stability. Both BCB and Flare glues provided good bonding integrity after backside grinding tests. Changes in the chemical structures of BCB and Flare glue during bonding were analyzed using FTIR in order to understand the bonding mechanism and to improve the bonding process.
UR - http://www.scopus.com/inward/record.url?scp=0036963601&partnerID=8YFLogxK
M3 - Conference article
AN - SCOPUS:0036963601
SN - 0272-9172
VL - 710
SP - 231
EP - 236
JO - Materials Research Society Symposium - Proceedings
JF - Materials Research Society Symposium - Proceedings
T2 - Polymer Interfaces and Thin Films
Y2 - 26 November 2001 through 30 November 2001
ER -