@inproceedings{94750d939607478088d60c8497104c9f,
title = "Wafer scale encapsulation of MEMS devices",
abstract = "MEMS packaging has always been a field of great importance since it can dominate the cost and size of a final working device. Considering this, we have concentrated on developing a wafer-scale encapsulation scheme which uses a thick epi-poly (epitaxially deposited poly silicon) layer as the sealing layer. This approach allows the use of conventional post processing, such as dicing, wire bonding, and other standard handling and mounting techniques. We also can minimize the chip area used for packaging, in some cases reducing the chip size by x5 from what was required for silicon fusion bonded covers. This packaging scheme can be used for various MEMS devices and can be integrated with other electronics. This paper will discuss the packaging process and show some preliminary results.",
author = "Park, {Woo Tae} and Junghwa Cho and Holden Li and Kenny, {Thomas W.} and Candler, {Rob N.} and Li, {Huimou J.} and Aaron Partridge and Gary Yama and Markus Lutz",
year = "2003",
doi = "10.1115/ipack2003-35032",
language = "English",
isbn = "0791836908",
series = "Advances in Electronic Packaging",
publisher = "American Society of Mechanical Engineers",
pages = "209--212",
booktitle = "Advances in Electronic Packaging 2003",
note = "2003 International Electronic Packaging Technical Conference and Exhibition ; Conference date: 06-07-2003 Through 11-07-2003",
}