TY - GEN
T1 - Wafer scale encapsulation of wide gaps using oxidation of sacrificial beams
AU - Ayanoor-Vitikkate, Vipin
AU - Chen, Kuan Lin
AU - Park, Woo Tae
AU - Yama, Gary
AU - Kenny, Thomas W.
PY - 2006
Y1 - 2006
N2 - This paper explores the possibility of using oxidation of sacrificial beams to encapsulate wide gaps. This method of oxidizing silicon beams in order to create diffusion barriers and structural supports has been reported in literatures. The idea is to encapsulate gaps of various widths in a method that is independent of the width of the gaps. In this experiment we try to encapsulate devices and structures with large gaps of the order of 10-20 μm using this technique and observe the results through SEM images.
AB - This paper explores the possibility of using oxidation of sacrificial beams to encapsulate wide gaps. This method of oxidizing silicon beams in order to create diffusion barriers and structural supports has been reported in literatures. The idea is to encapsulate gaps of various widths in a method that is independent of the width of the gaps. In this experiment we try to encapsulate devices and structures with large gaps of the order of 10-20 μm using this technique and observe the results through SEM images.
UR - http://www.scopus.com/inward/record.url?scp=50249134193&partnerID=8YFLogxK
U2 - 10.1109/IEMT.2006.4456470
DO - 10.1109/IEMT.2006.4456470
M3 - Conference contribution
AN - SCOPUS:50249134193
SN - 142440729X
SN - 9781424407293
T3 - Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
SP - 300
EP - 306
BT - Proceedings of the IEMT 2006 31st International Conference on Electronics Manufacturing and Technology
T2 - 31st International Electronics Manufacturing Technology Conference, IEMT 2006
Y2 - 8 November 2006 through 10 November 2006
ER -