Wetting and interfacial reaction characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys

A. Mi Yu, Mok Soon Kim, Chang Woo Lee, Jong Hyun Lee

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

Through the use of a wetting balance technique, the wetting characteristics of Sn-1.2Ag-0.5Cu-xIn quaternary solder alloys with respect to the In content and soldering temperature were investigated to validate the applicability of compositions with a low Ag content as solder material. It was found that a small addition (0.4-0.6 wt.%) of In significantly improved the wetting properties of the Sn-1.2Ag-0.5Cu-xIn composition at soldering temperatures ranging from 230 °C to 240 °C due to the excellent wetting property of In. In an observation of the interfacial reaction, it was found that the added In element did not participate in the interfacial reaction with a Cu or Ni pad, unlike in the Sn-Ag-Cu-In case, which has a high In content. The package or boardside IMC layers in Sn-1.2Ag-0.5Cu-0.4In joints were thinner than those of Sn-3.0Ag-0.5Cu, especially after aging.

Original languageEnglish
Pages (from-to)521-526
Number of pages6
JournalMetals and Materials International
Volume17
Issue number3
DOIs
StatePublished - Jun 2011

Keywords

  • Alloys
  • Interfaces
  • Scanning electron microscopy (SEM)
  • Soldering
  • Wetting

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